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首页> 外文期刊>Bulletin of the American Physical Society >APS -APS March Meeting 2017 - Event - Fabrication of Quench Condensed Thin Films Using an Integrated MEMS Fab on a Chip
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APS -APS March Meeting 2017 - Event - Fabrication of Quench Condensed Thin Films Using an Integrated MEMS Fab on a Chip

机译：APS -APS 2017年3月会议-活动-使用芯片上集成的MEMS Fab制造淬火冷凝薄膜

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Atomic calligraphy is a microelectromechanical systems (MEMS)-based dynamic stencil nanolithography technique. Integrating MEMS devices into a bonded stacked array of three die provides a unique platform for conducting quench condensed thin film mesoscopic experiments. The atomic calligraphy Fab on a Chip process incorporates metal film sources, electrostatic comb driven stencil plate, mass sensor, temperature sensor, and target surface into one multi-die assembly. Three separate die are created using the PolyMUMPs process and are flip-chip bonded together. A die containing joule heated sources must be prepared with metal for evaporation prior to assembly. A backside etch of the middle/central die exposes the moveable stencil plate allowing the flux to pass through the stencil from the source die to the target die. The chip assembly is mounted in a cryogenic system at ultra-high vacuum for depositing extremely thin films down to single layers of atoms across targeted electrodes. Experiments such as the effect of thin film alloys or added impurities on their superconductivity can be measured in situ with this process.
机译：原子书法是一种基于微机电系统（MEMS）的动态模板纳米光刻技术。将MEMS器件集成到三个管芯的粘合堆叠阵列中，为进行淬火浓缩薄膜介观实验提供了独特的平台。芯片上的原子书法Fab工艺将​​金属膜源，静电梳驱动的模板，质量传感器，温度传感器和目标表面结合到一个多管芯组件中。使用PolyMUMPs工艺创建三个单独的管芯，并将它们倒装芯片结合在一起。装有焦耳热源的模具必须在组装前用金属准备蒸发。中间/中央管芯的背面蚀刻暴露了可移动的模板，从而允许焊剂从源管芯到目标管芯通过模板。芯片组件安装在超高真空的低温系统中，用于在目标电极上沉积极薄的薄膜，直至原子的单层。诸如薄膜合金或添加的杂质对其超导性的影响等实验可通过此过程进行现场测量。

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