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首页> 美国卫生研究院文献>Micromachines >Fabrication of Simultaneously Implementing Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips on a Film Substrate by Screen-Offset Printing
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Fabrication of Simultaneously Implementing Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips on a Film Substrate by Screen-Offset Printing

机译：通过屏幕胶印在薄膜基板上同时实现有线面朝上和面朝下的超薄压阻Si芯片的制造

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摘要

We realized the implementation of an ultrathin piezoresistive Si chip and stretchable printed wires on a flexible film substrate using simple screen-offset printing technology. This process does not require a special MEMS fabrication equipment and is applicable to face-up chips where electrodes are formed on the top surface of the chip, as well as to face-down chips where electrodes are formed on the bottom surface of the chip. This fabrication process is quite useful in the field of flexible hybrid electronics (FHE) as a method for mounting and wiring electronic components on a flexible substrate. In this study, we confirmed that face-up and face-down chips could be mounted on polyimide film tape. Furthermore, it was confirmed that the two types of chips could be simultaneously mounted even if they exist on the same substrate. Five-μm-thick piezoresistive Si chips were transferred and wired on a polyimide film tape using screen-offset printing, and a band-plaster type blood pulse sensor was fabricated. Moreover, we successfully demonstrated that the blood pulse could be measured with neck, inner elbow, wrist, and ankle.
机译：我们使用简单的丝网印刷技术在柔性膜基板上实现了超薄压阻Si芯片和可拉伸印刷线的实现。该工艺不需要特殊的MEMS制造设备，并且适用于在芯片的顶表面上形成有电极的面朝上的芯片，以及在芯片的底表面上形成有电极的面朝下的芯片。作为在柔性基板上安装和布线电子部件的方法，这种制造工艺在柔性混合电子器件（FHE）领域中非常有用。在这项研究中，我们确认可以将面朝上和面朝下的芯片安装在聚酰亚胺薄膜胶带上。此外，证实了即使两种芯片都存在于同一基板上也可以同时安装。转移5μm厚的压阻Si芯片，并使用丝网胶版印刷将其布线在聚酰亚胺膜带上，从而制造出带状膏药型脉搏传感器。此外，我们成功地证明了可以用颈部，内肘，手腕和脚踝测量脉搏。

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