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首页> 外文期刊>Coatings >Analysis of the Surface/Interface Damage Evolution Behavior of a Coating–Substrate System under Heavy-Load Elastohydrodynamic Lubrication
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Analysis of the Surface/Interface Damage Evolution Behavior of a Coating–Substrate System under Heavy-Load Elastohydrodynamic Lubrication

机译：重载弹性流体动力学润滑下涂层基板系统的表面/接口损伤演化行为分析

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摘要

Keeping a coating–substrate system undamaged during heavy-load elastohydrodynamic lubrication (EHL) conditions is challenging. To overcome this problem, an EHL model with a coated gear pair was built. Firstly, based on the full-system finite element method, the effect of the coating elastic modulus on the oil film pressure was obtained. Secondly, the failure mode was predicted after the stress analysis. Finally, the surface/interface damage evolution behavior of the coating–substrate system was analyzed visually by embedding cohesive zone elements. In the numerical calculation, stiffer coatings tended to increase the film pressure and secondary pressure spike, compared with more compliant coatings. As the coating stiffness decreased, the maximum equivalent stress in the system reduced, and its location tended to develop close to or at the substrate. The coating cracking and interfacial delamination were individually caused by the shear stress in the coating and shear stress on the interface, and both of them initiated in the region of the secondary pressure peak. The interfacial delamination increased the crack failure probability of coating and vice versa. Therefore, through analyzing the EHL model, the exact damage growth location and its evolution in the coated solids can be determined, and the failure mechanism can be comprehensively revealed.
机译：在重载弹性流体动力学润滑（EHL）条件下保持涂层衬底系统未受损坏的情况是具有挑战性的。为了克服这个问题，建立了带有涂层齿轮对的EHL模型。首先，基于全系统有限元方法，获得涂层弹性模量对油膜压力的影响。其次，在应力分析后预测失败模式。最后，通过嵌入粘性区域元素在视觉上分析涂层衬底系统的表面/接口损伤进化行为。在数值计算中，与更柔顺的涂层相比，致脂涂层倾向于增加膜压力和次要压力尖峰。随着涂层刚度降低，系统中的最大等效应力降低，其位置倾向于在靠近或基板上显影。涂层开裂和界面分层由涂层中的剪切应力和界面上的剪切应力进行单独引起，并且它们在次级压力峰的区域中引发。界面分层增加了涂层的裂纹失效概率，反之亦然。因此，通过分析EHL模型，可以确定涂覆固体中的确切损伤生长位置及其演化，并且可以全面地揭示故障机制。

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