机译:通过表面污染层对印刷电路板聚合物涂层进行击穿的观察
School of Electrical and Electronic Engineering (EEE), The University of Manchester, Manchester United Kingdom;
School of Materials, The University of Manchester, Manchester United Kingdom;
School of Electrical and Electronic Engineering (EEE), The University of Manchester, Manchester United Kingdom;
School of Electrical and Electronic Engineering (EEE), The University of Manchester, Manchester United Kingdom;
School of Materials, The University of Manchester, Manchester United Kingdom;
Coatings; Pollution; Electric breakdown; Surface contamination; Surface treatment; Degradation; Insulation life;
机译:微型钻头上用于加工印刷电路板的纳米层CrNx / WNy涂层
机译:具有低热膨胀系数的可溶液加工的CF3取代的延展性聚酰亚胺,作为柔性印刷电路板中的新型涂层型保护层
机译:低压磁场下印刷电路板的表面击穿
机译:金属基印刷电路板绝缘层的原位充电观察
机译:使用FDTD和带有电路提取的混合电位积分方程方法,对多层印刷电路板中的DC电源总线互连,分段和信号过渡进行建模和设计。
机译:薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
机译:通过表面污染层观察印刷电路板聚合物涂层的击穿
机译:用焊料涂覆印刷电路板上的电路路径的方法