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Infrared focal plane array incorporating silicon IC process compatible bolometer

机译:结合了硅IC工艺兼容测辐射热仪的红外焦平面阵列

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摘要

A 128/spl times/128 element bolometer infrared image sensor using thin film titanium is proposed. The device is a monolithically integrated structure with a titanium bolometer detector located over a CMOS circuit that reads out the bolometer's signals. By employing a metallic material like titanium and refining the CMOS readout circuit, it is possible to minimize 1/f noise. It is demonstrated that the use of low 1/f noise material will help increase bias current and improve the S/N ratio. Since the fabrication process is silicon-process compatible, costs can be kept low.
机译:提出了一种采用薄膜钛的128 / spl次/ 128元件测辐射热仪红外图像传感器。该设备是单片集成结构,其钛金属测辐射热计检测器位于CMOS电路上方,该电路可读取测辐射热计的信号。通过采用金属材料(例如钛)并完善CMOS读出电路,可以将1 / f噪声降至最低。事实证明,使用低1 / f噪声材料将有助于增加偏置电流并改善信噪比。由于制造工艺与硅工艺兼容,因此可以保持较低的成本。

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