Wireless chip to chip interconnection for multichip modules using leaky wave antennas

Iyer M.K.; Seager R.D.

首页> 外文期刊>Electronics Letters >Wireless chip to chip interconnection for multichip modules using leaky wave antennas

【24h】

Wireless chip to chip interconnection for multichip modules using leaky wave antennas

机译：使用漏波天线的多芯片模块的无线芯片到芯片互连

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

A novel interchip communication technique for very high speed multichip modules is presented. The feasibility of using a dielectric guide leaky wave antenna integrated on a chip for transmission and reception is discussed. J-band measurements and predictions based on a model developed using the transmission line matrix (TLM) method are compared.

机译：提出了一种用于超高速多芯片模块的新颖的芯片间通信技术。讨论了使用集成在芯片上的介质波导漏波天线进行发射和接收的可行性。比较了基于使用传输线矩阵（TLM）方法开发的模型的J波段测量和预测。

著录项

来源
《Electronics Letters》 |1993年第23期|P.2030-2031|共2页
作者
Iyer M.K.; Seager R.D.;
展开▼
作者单位

Dept. of Electron. & Electr. Eng., Loughborough Univ. of Technol., UK;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词
dielectric waveguides; microwave measurement; multichip modules; waveguide antennas; J-band measurements; TLM method; dielectric guide leaky wave antenna; interchip communication technique; transmission line matrix method; wireless chip to chip interconnection;

机译：介质波导;微波测量;多芯片模块;波导天线;J带测量;TLM方法;介质波导漏波天线;芯片间通信技术;传输线矩阵法;无线芯片到芯片互连;

相似文献

外文文献
中文文献
专利

1. A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips [J] . Hopper A., Jones A. IEEE Transactions on Components, Hybrids, and Manufacturing Technology . 1992,第1期

机译：利用电子束光刻技术制造平面硅多芯片模块以精确定位和互连芯片的可行性研究
2. A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module [J] . Lee K.-W., Kanno S., Kiyoyama K., Microelectromechanical Systems, Journal of . 2010,第6期

机译：腔体芯片互连技术，用于MEMS-LSI多芯片模块中的厚MEMS芯片集成
3. Multichip optical transmitter module for chip-to-chip interconnection on optical PCBs [J] . Kang S.-K., Lee T.-W., Hwang S.H., Electronics Letters . 2006,第14期

机译：多芯片光学发射器模块，用于光学PCB上的芯片间互连
4. Optical Interconnection Between Flip-chip Bonded Photodiodes And Optical Polyimide Waveguides On An Opto-electronic Multichip Module [C] . Takahara, H., Matsui, . 1994

机译：光电多芯片模块上倒装芯片键合光电二极管和光学聚酰亚胺波导之间的光学互连
5. Overshoot controlled interconnection design for multichip modules (MCM's). [D] . Mi, Wei. 1991

机译：多芯片模块（MCM）的过冲控制互连设计。
6. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems [O] . Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, 2015

机译：用于无线供电的神经接口系统的薄膜柔性天线和硅CMOS整流器芯片的协同设计方法和晶圆级封装技术
7. A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas [O] . Iyer Mahadevan K. 1994

机译：使用漏波天线的千兆位逻辑多芯片模块的新型芯片对芯片辐射互连技术
8. Optical Interconnect Technology (OIT) Multichip Module to Multichip Module [R] . Bristow, J. , Liu, Y. , Johnson, K. 1998

机译：光学互连技术（OIT）多芯片模块到多芯片模块

Wireless chip to chip interconnection for multichip modules using leaky wave antennas

摘要

著录项

相似文献

相关主题

期刊订阅