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Enhancement of the thermal conductivity of adhesives for wood flooring using xGnP

机译：使用xGnP增强木地板胶粘剂的导热性

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摘要

Using exfoliated graphite nanoplatelets (xGnP), resin/xGnP composites were prepared by stirring xGnP in the epoxy resin with hardener and polyurethane(PU) resin to increase the thermal conductivity of an under-floor heating system using wood flooring. xGnP of 1, 2 and 3 wt% was added to pure epoxy and PU resin at room temperature. The thermal conductivity of resin/xGnP composites was increased with the increased with the increase of xGnP loading contents. Also, the increased bonding strength of epoxy/xGnP composite was manifested in the results of a single lap shearing test. Harden resin/xGnP composites showed endothermic energy curves according to thermal conductivity by differential scanning calorimeter (DSC) measurement. Resin/xGnP composites showed higher thermal conductivity than pure resins and absorbed less energy than pure resins with increasing temperature. Applying xGnP to the installation resin of wood flooring cannot only be effective in increasing the thermal conductivity of installation resin but is also inexpensive, has easy dispersion and good mechanical properties.
机译：使用片状石墨纳米片（xGnP），通过在环氧树脂中与硬化剂和聚氨酯（PU）树脂一起搅拌xGnP，以增加使用木地板的地板采暖系统的导热性，从而制备树脂/ xGnP复合材料。在室温下，将1、2和3 wt％的xGnP添加到纯环氧树脂和PU树脂中。树脂/ xGnP复合材料的导热系数随着xGnP含量的增加而增加。同样，环氧/ xGnP复合材料的结合强度增加也体现在单次剪切试验的结果中。硬化树脂/ xGnP复合材料通过差示扫描量热仪（DSC）测量根据热导率显示吸热能曲线。树脂/ xGnP复合材料显示出比纯树脂更高的导热率，并且随着温度的升高，其吸收的能量比纯树脂少。将xGnP应用于木地板的安装树脂不仅可以有效地提高安装树脂的导热系数，而且价格便宜，具有易于分散和良好的机械性能。

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