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首页> 外文期刊>Energy Conversion & Management >Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices
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Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices

机译：用于冷却电子器件的新型超薄蒸气室的设计，制造和热性能

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In this work, a novel vapour-liquid channel-separated ultra-thin (0.4-mm-thick) vapour chamber fabricated via etching and diffusion bonding was designed for cooling electronic devices. The heat performance of ultra-thin vapour chamber was tested under five states, and micropillar arrays were etched into the chamber to study their effect on heat transfer. Additionally, infrared thermal imaging was performed to investigate the heat dissipation of cooling modules with and without the ultra-thin vapour chamber. The maximum heat transfer capacity of the ultra-thin vapour chamber in the horizontal state was 4.50 W, and the temperature difference was 4.75 degrees C. The experimentally measured values were very close to the theoretical capillary limit. Under normal and reverse gravities, the maximum heat transfer capacity changed by less than 11%. The effective thermal conductivity of the ultra-thin vapour chamber was 12000 W/(m.K), which is 30 times higher than that of pure copper. The cooling module with the ultra-thin vapour chamber exhibited better heat dissipation, thermal uniformity and thermal response properties. When the heating input power was 6 W, the heating block temperature, maximum surface temperature difference and equilibrium time of the cooling module with the ultra-thin vapour chamber were 8%, 54% and 32% lower, respectively, than those of the module without the ultra-thin vapour chamber. The proposed cooling solution is promising for heat dissipation problems in high-power portable electronic devices.
机译：在这项工作中，设计了通过蚀刻和扩散键合制造的新型蒸汽通道分离的超薄（0.4mm厚的）蒸气室，用于冷却电子器件。在五个状态下测试超薄蒸气室的热性能，并将微漏阵列蚀刻到腔室中以研究它们对热传递的影响。另外，进行红外热成像以研究具有和不具有超薄蒸气室的冷却模块的散热。水平状态下的超薄蒸汽室的最大传热能力为4.50W，温度差为4.75℃。实验测量值非常接近理论毛细管极限。在正常和反向的重力下，最大传热能力的变化不到11％。超薄蒸气室的有效导热率为12000W /（M.K），比纯铜的30倍高。具有超薄蒸气室的冷却模块表现出更好的散热，热均匀性和热响应性能。当加热输入功率为6W时，冷却模块的加热块温度，最大表面温度和平衡时间与超薄蒸气室分别比模块的超薄蒸气室分别为8％，54％和32％没有超薄蒸汽室。所提出的冷却解决方案在高功率便携式电子设备中具有散热问题。

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