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首页> 外文期刊>Environmental engineering and management journal >DISSOLUTION OF BASE METALS FROM WASTE PRINTED CIRCUIT BOARDS
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DISSOLUTION OF BASE METALS FROM WASTE PRINTED CIRCUIT BOARDS

机译：废印刷电路板中贱金属的溶解

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摘要

The aim of the present study was to determine the most feasible experimental conditions for the dissolution of base metals (Cu, Ni, Zn, Pb, etc.) from waste printed circuit boards (WPCBs) obtained from WMP. The leaching of WPCB samples was performed with FeCl3 in HCl solution which allowed the separation of a precious metal rich solid residue and a high base metal concentration solution adequate for base metal recovery. The most favorable conditions for the leaching process were identified on the basis of the defined technical key performance indicators at different HCl (0.1 M-0.3 M) and FeCl3 (0.2 M-0.4 M) concentrations. The highest performances for the dissolution process were obtained at 0.2 M HCl and 0.3 M FeCl3, in a 4 h period, while at a longer leaching period (24 h) at 0.3 M HCl and 0.3 M FeCl.
机译：本研究的目的是确定从WMP获得的废印刷电路板（WPCB）中溶解贱金属（Cu，Ni，Zn，Pb等）的最可行实验条件。使用HCl溶液中的FeCl3进行WPCB样品的浸出，可以分离出富含贵金属的固体残留物和足以回收贱金属的高贱金属浓度溶液。根据已定义的技术关键性能指标，在不同的HCl（0.1 M-0.3 M）和FeCl3（0.2 M-0.4 M）浓度下，确定了浸出过程的最有利条件。溶解过程的最高性能是在4小时内在0.2 M HCl和0.3 M FeCl3下获得的，而在0.3 M HCl和0.3 M FeCl的浸出过程中更长的时间（24小时）下获得的。

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