IMT modernizes MEMS foundry services with plasma etch solution

首页> 外文期刊>European Semiconductor >IMT modernizes MEMS foundry services with plasma etch solution

【24h】

IMT modernizes MEMS foundry services with plasma etch solution

机译：IMT通过等离子体蚀刻解决方案现代化MEMS铸造服务

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

INNOVATIVE MICRO TECHNOLOGY (IMT), a global leader in the development and production of complex microelectromechanical systems (MEMS), today announced the purchase of an Omega Rapier plasma etch system from SPTS Technologies, a KLA company. The installation of the Rapier™ this month will put IMT at the cutting edge of MEMS and sensors manufacturing and extends development and production capability for its growing customer base in photonics, BioMEMS and sensors.

机译：创新的微型技术（IMT）是复杂微机电系统（MEMS）的开发和生产的全球领导者，今天宣布购买来自KLA公司SPTS Technologies的Omega剑杆菌等离子体蚀刻系统。本月的Rapier™的安装将在MEMS和传感器的切削刃上放置IMT，并扩展其在光子，生物邮件和传感器中越来越多的客户群的开发和生产能力。

著录项

来源
《European Semiconductor》 |2020年第5期|6-6|共1页
作者

展开▼
作者单位

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. GigOptix transfers TFPS fabrication to IMT MEMS foundry for volume production [J] . Optical Networks WDM . 2010,第11期

机译：GigOptix将TFPS制造转移到IMT MEMS代工厂进行批量生产
2. Surface energy and wetting behaviour of plasma etched porous SiCOHsurfaces and plasma etch residue cleaning solutions [J] . Nicole Ahner, Matthias Schaller, Christin Bartsch, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2009,第Null期

机译：等离子刻蚀多孔SiCOH表面和等离子刻蚀残留物清洁溶液的表面能和润湿行为
3. Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions [J] . Nicole Ahner, Matthias Schaller, Christin Bartsch, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2009,第0期

机译：等离子蚀刻的多孔SiCOH表面和等离子蚀刻残留物清洁溶液的表面能和润湿行为
4. Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions [C] . Nicole Ahner, Matthias Schaller, Christin Bartsch, International Symposium on Ultra Clean Processing of Semiconductor Surfaces . 2009

机译：等离子体蚀刻多孔SiCOH表面和等离子体蚀刻残留清洁溶液的表面能和润湿行为
5. Plasma characterization and correlation with the etch rate and via sidewall angle in a deep reactive ion etch system using Langmuir probe and optical emission spectroscopy. [D] . Koirala, Sudip Prasad. 2010

机译：在使用Langmuir探针和光发射光谱法的深反应离子刻蚀系统中，等离子体表征和刻蚀速率以及通孔侧壁角度相关。
6. Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes [O] . Giuseppe Schiavone, Jeremy Murray, Richard Perry, 2017

机译：具有低温沉积和蚀刻工艺的MEMS中电沉积Ni-Fe的集成
7. EVALUATION OF AN O2 PLASMA AND XeF2 VAPOR ETCH RELEASE PROCESSES FOR RF MEMS SWITCHES FABRICATED USING CMOS INTERCONNECT PROCESSES [O] . C.V. Jahnes, N. Hoivik, J.M. Cotte, 2006

机译：使用CMOS互连工艺制造的RF MEMS开关的O2等离子体和XEF2蒸汽蚀刻释放工艺的评价
8. Plasma and Ion Etching for Failure Analysis. Part 2. The Etching of Plastic Encapsulant and Other Semiconductor Device Materials, Using the Technics Giga Etch 100-E Plasma Etch System [R] . Hardman, M., Mapper, D., Farren, J., 1986

机译：等离子体和离子蚀刻用于失效分析。第2部分。使用Technics Giga Etch 100-E等离子蚀刻系统对塑料封装和其他半导体器件材料进行蚀刻

IMT modernizes MEMS foundry services with plasma etch solution

摘要

著录项

相似文献

相关主题

期刊订阅