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Numerical Simulation of Bubble Growth and Heat Transfer During Flow Boiling in a Surface-Modified MicroChannel

机译：表面改性微通道沸腾过程中气泡生长和传热的数值模拟

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摘要

Flow boiling in a microchannel without or with surface modifications, such as fins, grooves, and cavities, has received significant attention as an effective cooling method for high-power microelectronic devices. However, a general predictive approach for the boiling process has not yet been developed because of its complexity involving the bubble dynamics coupled with boiling heat transfer in a microscale channel. In this study, direct numerical simulations for flow boiling in a surface-modified microchannel are performed by solving the conservation equations of mass, momentum, and energy in the liquid and vapor phases. The bubble surfaces are determined by a sharp-interface level-set method, which is modified to include the effect of phase change at the liquid-vapor interface and to treat the no-slip and contact-angle conditions on immersed solid surface of microstructures. This computation demonstrates that the surface-modified microchannel enhances boiling heat transfer significantly compared to a plain microchannel. The effects of various surface modifications on the bubble growth and heat transfer are investigated to find better conditions for boiling enhancement.
机译：作为具有高功率微电子器件的一种有效的冷却方法，在未经修饰或未经修饰（例如散热片，凹槽和空腔）的微通道中进行沸腾流动已引起广泛关注。然而，由于其复杂性涉及气泡动力学以及在微尺度通道中的沸腾传热，因此尚未开发出用于沸腾过程的一般预测方法。在这项研究中，通过求解液相和气相的质量，动量和能量守恒方程，对表面改性微通道中的沸腾进行了直接数值模拟。气泡表面是通过锐化界面能级设置方法确定的，该方法经过修改以包括液-气界面处的相变影响，并处理微结构浸没固体表面上的无滑移和接触角条件。该计算表明，与普通微通道相比，表面改性的微通道显着增强了沸腾传热。研究了各种表面改性对气泡生长和传热的影响，以找到更好的沸腾增强条件。

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  • 来源
    《Heat Transfer Engineering》 |2014年第8期|501-507|共7页
  • 作者

    WOORIM LEE; GIHUN SON;

  • 作者单位

    Department of Mechanical Engineering, Sogang University, Seoul, Korea;

    Department of Mechanical Engineering, Sogang University, Shinsu-dong, Mapo-ku, Seoul 121-742, Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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