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首页> 外文期刊>Heat Transfer Engineering >Comparative Analysis Of Microchannel Heat Sink Configurations Subject To A Pressure
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Comparative Analysis Of Microchannel Heat Sink Configurations Subject To A Pressure

机译：压力下微通道散热器结构的比较分析

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摘要

Leakage losses and ever-increasing power dissipation in the microprocessor are causing significant thermal, mechanical, and reliability problems. Conventional cooling methods are reaching their practical limits, and new methods of lowering the operating temperature of microprocessors are being explored. Microfluidics-based cooling schemes are one approach being considered. The implementation of microchannels for forced convection at the chip level shows much promise, as the effective heat transfer surface area and attainable heat flux are very favorable. A major design limitation to such an implementation is the pressure developed within such micro-flows and the stresses that could result. In this study, multiple discrete microchannel heat sink configurations are analyzed computationally and compared in a cooling capability sense, while total pressure drop across the flows is carefully considered. A single cooling channel over an energy source is split into two smaller channels, and so on, while total pressure drop is maintained constant, and specified such that all flows remain in the laminar regime. It is shown that for the configurations analyzed, there exists multiple-dependence optimum cooling configurations. In addition, it is shown that a slimmer design may be implemented with a relatively small effect on cooling capability. Furthermore, cooling capability dependence on total pressure drop of the flows is shown to be minimal for high-performing microchannel configurations.
机译：微处理器中的泄漏损耗和不断增加的功耗导致了严重的散热，机械和可靠性问题。常规的冷却方法已达到其实际极限，并且正在探索降低微处理器工作温度的新方法。基于微流体的冷却方案是一种正在考虑的方法。在芯片级实现强制对流的微通道具有很大的前景，因为有效的传热表面积和可获得的热通量非常有利。这种实现方式的主要设计限制是在这种微流中产生的压力和可能产生的应力。在这项研究中，对多个离散的微通道散热器配置进行了计算分析，并从冷却能力的角度进行了比较，同时仔细考虑了整个流的总压降。能源上方的单个冷却通道被分成两个较小的通道，依此类推，同时总压降保持恒定，并指定为使所有流量保持层流状态。结果表明，对于所分析的配置，存在多个相关的最佳冷却配置。另外，示出了可以实现更薄的设计，而对冷却能力的影响相对较小。此外，对于高性能微通道配置，冷却能力对流体总压降的依赖性显示为最小。

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  • 来源
    《Heat Transfer Engineering》 |2009年第2期|43-53|共11页
  • 作者

    DYLAN FARNAM; BAHGAT SAMMAKIA; HAROLD ACKLER; KANAD GHOSE;

  • 作者单位

    Mechanical Engineering Department, State University of New York at Binghamton. IEEC, P.O. Box 6000, Vestal Parkway East, Binghamton, NY 13902-6000, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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