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首页> 外文期刊>Industrial Electronics Magazine, IEEE >High-Temperature Hardware: Development of a 10-kW High-Temperature, High-Power-Density Three-Phase ac-dc-ac SiC Converter
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High-Temperature Hardware: Development of a 10-kW High-Temperature, High-Power-Density Three-Phase ac-dc-ac SiC Converter

机译：高温硬件：开发10 kW高温，高功率密度三相AC-DC-AC SiC转换器

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摘要

This article presents the development and experimental performance of a 10-W, all-silicon carbide (SiC), 250 °C junction temperature, high-powerdensity, three-phase acdcac converter. The electromagnetic interference filter, thermal system, high-temperature package, and gate drive design are discussed in detail. Tests confirming the feasibility and validating the theoretical basis of the prototype converter system are described. Over the last 20 years, advances in industrial and research efforts in electronic power conversion have steadily been moving toward higher power densities, which has resulted in improvements in converter system performance; reductions in physical size; and reductions in mass, weight, and cost [1], [39]. However, this pushes the limits of the existing control, packaging, and thermal management technology for power converter systems.
机译：本文介绍了10W全碳化硅（SiC），250°C结温，高功率密度，三相acdcac转换器的开发和实验性能。详细讨论了电磁干扰滤波器，热系统，高温封装和栅极驱动器设计。描述了证实原型转换器系统可行性和验证理论基础的测试。在过去的20年中，电子功率转换的工业和研究工作一直在稳步向更高的功率密度方向发展，从而提高了转换器系统的性能。缩小体型；并减少了质量，重量和成本[1]，[39]。但是，这限制了功率转换器系统的现有控制，封装和热管理技术的局限性。

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