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首页> 外文期刊>IEEE microwave magazine >Innovations in Terahertz Interconnects: High-Speed Data Transport Over Fully Electrical Terahertz Waveguide Links
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Innovations in Terahertz Interconnects: High-Speed Data Transport Over Fully Electrical Terahertz Waveguide Links

机译：太赫兹互连技术的创新：全电气太赫兹波导链路上的高速数据传输

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摘要

The continued increase in computing capability that has occurred through the technology scaling foretold by Moore [1] and Dennard et al. [2] has led to a commensurate increase in the input-output requirements of computing systems. This phenomenon has been most significantly experienced in terms of the interconnect technologies in large data centers (DCs) and high-performance computing (HPC) applications. Historical data have shown a two to three times increase in aggregate data rates every two years [3]. This space covers a variety of different interconnect length scales. In a comprehensive survey by Thraskias et al. [4], high-speed interconnects are grouped according to the following taxonomy.
机译：通过Moore [1]和Dennard等人预言的技术扩展，计算能力不断提高。 [2]导致计算系统的输入输出要求相应增加。就大型数据中心（DC）和高性能计算（HPC）应用程序中的互连技术而言，这种现象最为明显。历史数据显示，每两年总数据传输率增加2到3倍[3]。该空间覆盖了各种不同的互连长度范围。在Thraskias等人的综合调查中。 [4]，根据以下分类将高速互连分组。

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