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首页> 外文期刊>Photonics Technology Letters, IEEE >A Two-Wafer Approach for Integration of Optical MEMS and Photonics on Silicon Substrate
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A Two-Wafer Approach for Integration of Optical MEMS and Photonics on Silicon Substrate

机译：在硅衬底上集成光学MEMS和光子学的两晶片方法

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摘要

This letter reports a novel two-wafer approach which demonstrates an integration of optical microelectromechanical system (MEMS) devices and photonics on a silicon substrate. The great advantage of this novel wafer bonding scheme is the ability to maintain the optical axis of the optical MEMS device at the same axis as the optical components. The bonded two wafers which are partially processed, which allows for further processing on the wafer after bonding. Thus, the critical alignment issue is resolved for devices requiring precise alignment in x-/y-/z-axis. Individual functionalities of optical MEMS device and optical coupling between silicon waveguide, fibers and ball lens are demonstrated. This technology shows the potential for integrating silicon photonics integrated circuit and MEMS components with reconfiguration functions on a single silicon substrate.
机译：这封信报道了一种新颖的两晶片方法，该方法证明了光学微机电系统（MEMS）器件和光子在硅衬底上的集成。这种新颖的晶片键合方案的最大优点是能够将光学MEMS器件的光轴保持在与光学组件相同的轴上。接合的两个晶片经过部分处理，可以在接合后对晶片进行进一步处理。因此，对于需要在x / y / z轴上精确对齐的设备，解决了关键的对齐问题。演示了光学MEMS器件的各个功能以及硅波导，光纤和球形透镜之间的光耦合。这项技术显示了在单个硅基板上集成具有重新配置功能的硅光子集成电路和MEMS组件的潜力。

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