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首页> 外文期刊>Circuits and Systems I: Regular Papers, IEEE Transactions on >Electrothermal Design Procedure to Observe RF Circuit Power and Linearity Characteristics With a Homodyne Differential Temperature Sensor
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Electrothermal Design Procedure to Observe RF Circuit Power and Linearity Characteristics With a Homodyne Differential Temperature Sensor

机译:电热设计程序,使用霍莫达尼温差传感器观察射频电路的功率和线性特性

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摘要

The focus in this paper is on the extraction of RF circuit performance characteristics from the dc output of an on-chip temperature sensor. Any RF input signal can be applied to excite the circuit under examination because only dissipated power levels are measured, which makes this approach attractive for online thermal monitoring and built-in test scenarios. A fully differential sensor topology is introduced that has been specifically designed for the proposed method by constructing it with a wide dynamic range, programmable sensitivity to dc, and RF power dissipation, as well as compatibility with CMOS technology. This paper also presents an outline of a procedure to model the local electrothermal coupling between heat sources and the sensor, which is used to define the temperature sensor's specifications as well as to predict the thermal signature of the circuit under test.
机译:本文的重点是从片上温度传感器的直流输出中提取射频电路性能特征。可以应用任何RF输入信号来激发被检查的电路,因为仅会测量耗散的功率电平,这使得该方法对于在线热监测和内置测试方案具有吸引力。引入了一种全差分传感器拓扑结构,该拓扑结构针对宽泛的动态范围,可编程的dc灵敏度,RF功耗以及与CMOS技术的兼容性而专门针对该方法进行了设计。本文还介绍了对热源与传感器之间的局部电热耦合进行建模的过程概述,该过程用于定义温度传感器的规格以及预测被测电路的热信号。

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