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首页> 外文期刊>Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on >Modeling STI Edge Parasitic Current for Accurate Circuit Simulations
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Modeling STI Edge Parasitic Current for Accurate Circuit Simulations

机译:建模STI边缘寄生电流以进行精确的电路仿真

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摘要

We enhance the capability of industry standard compact model BSIM6 to model the parasitic current at the shallow trench isolation edge. Accurate, efficient, and scalable model for is developed by finding the key differences between and main device drain current (). It is found that has a different sub-threshold slope, body-bias coefficient, and short-channel behavior as compared to . These important effects along with their dependencies on device geometry, bias conditions, and temperature are accounted for in the model. The model is in excellent agreement with experimental data verifying its scalability and readiness for production level usage.
机译:我们增强了行业标准紧凑模型BSIM6的能力,可以对浅沟槽隔离边缘处的寄生电流进行建模。通过找到主器件漏极电流与主器件漏极电流()之间的关键差异,可以开发出一种精确,高效且可扩展的模型。与相比,发现具有不同的亚阈值斜率,体偏置系数和短通道行为。这些重要影响以及它们对器件几何形状,偏置条件和温度的依赖性都在模型中得到了说明。该模型与实验数据非常吻合,验证了其可扩展性和为生产水平使用做好准备。

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