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Board level solder reliability versus ramp rate and dwell time during temperature cycling

机译:板级焊料的可靠性与温度循环期间的升温速率和停留时间的关系

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Effects of ramp rate and dwell time are studied through laboratory results and a nts (DOE) using finite element analysis (FEA) incorporating stress/strain and plastic work history. Results demonstrate that solder joint fatigue life is more sensitive to dwell time than ramp rate during thermal cycling. A nonlinear relationship exists between solder fatigue life (mean time to failure, MTTF) and dwell time. Increasing dwell time past 20 min has a minimal effect on the acceleration factor or lifetime. Modeling shows that the acceleration factor increases by a factor of 1.23 for a specific ball grid array (BGA) assembly when the test condition changes from a slow ramp/long dwell (single chamber) to a fast ramp/short dwell (dual chamber). Experiments were performed to validate the FEA modeling. Different ramp time/dwell times were achieved by modulating the temperature profile in a single chamber oven. If dwell time changes from 5 to 10 min with an invariant ramp time of 5 min, apparent MTTF decreases by 55%. However, if the invariant dwell time is 10 min, MTTF remains practically the same as the ramp time increases from 5 to 10 min. These test results are consistent with modeling predictions. The focus of temperature cycling tests should not be on number of chambers, nor upon ramp rate, but upon dwell time. We recommend 8 to 10 min dwell at a high temperature of 125/spl deg/C.
机译:通过实验室结果和使用应力/应变和塑性加工历史的有限元分析(FEA)来研究斜率和停留时间的影响。结果表明,在热循环过程中,焊点疲劳寿命对保压时间的敏感度比斜率高。焊料疲劳寿命(平均失效时间,MTTF)和停留时间之间存在非线性关系。超过20分钟的停留时间增加对加速系数或寿命的影响最小。建模显示,当测试条件从慢速倾斜/长停留(单腔)变为快速斜率/短停留(双腔)时,对于特定的球栅阵列(BGA)组件,加速因子增加了1.23倍。进行实验以验证FEA建模。通过调节单室烤箱中的温度曲线,可以实现不同的斜坡时间/停留时间。如果停留时间从5分钟变为10分钟,且斜坡时间不变为5分钟,则表观MTTF降低55%。但是,如果不变的停留时间为10分钟,则MTTF实际上与斜坡时间从5分钟增加到10分钟相同。这些测试结果与建模预测一致。温度循环测试的重点不应放在试验箱的数量上,也不应该放在斜率上,而应放在停留时间上。我们建议在125 / spl deg / C的高温下停留8至10分钟。

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