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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance
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Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance

机译：铜与金属间界面上空洞形成对老化跌落测试性能的作用研究

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Chip-scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability requirement for these products. With the switch to lead-free solder, new reliability data must be generated. Most drop test reliability data reported for CSPs are for the as-built condition. However, the mechanical shock reliability over the life of the product is equally important. This paper provides a systematic study of surface finish (immersion Sn and immersion Ag) and reflow profile (cool down rate) on the drop test reliability of CSP assemblies. A limited experiment was also performed with organic solderability preservative (OSP)-coated boards. The Sn finish provides an initial Cu-Sn intermetallic layer, while the Ag finish and OSP coating allows the formation of the initial Cu-Sn intermetallic during the reflow cycle. Drop test results for assemblies as-built and as a function of aging at 125 degC are correlated with cross-sectional analysis of the solder joints. The mean number of drops to failure decreases by approximately 80% with aging at 125 degC through 480 h. Voids develop at the Cu-Sn intermetallic-to-Cu interface during high-temperature aging, but the crack path is through the intermetallic layer and does not propagate from void-to-void. Thus, it can be concluded that the voids do not contribute to the decrease in drop test survivability observed in this study
机译：芯片级封装（CSP）广泛用于便携式电子产品。机械跌落测试是这些产品的关键可靠性要求。使用无铅焊料后，必须生成新的可靠性数据。报告的大多数CSP跌落测试可靠性数据是针对建成条件的。但是，在产品使用寿命内的机械冲击可靠性同样重要。本文对CSP组件的跌落测试可靠性进行了系统的表面处理（浸锡和浸银）和回流曲线（冷却速率）的系统研究。还使用有机可焊性防腐剂（OSP）涂层板进行了有限的实验。锡精加工提供初始的Cu-Sn金属间化合物层，而银精加工和OSP涂层允许在回流周期中形成初始的Cu-Sn金属间化合物。组装后的跌落测试结果以及在125℃下老化的结果与焊点的横截面分析相关。在125℃到480小时的老化过程中，失效的平均次数下降了约80％。在高温时效期间，Cu-Sn金属间-Cu界面处会形成空隙，但裂纹路径是通过金属间层，并且不会在空隙间传播。因此，可以得出结论，在本研究中观察到的空隙不会导致跌落测试生存能力的降低

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