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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process
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Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process

机译：评估由于制造后浸焊而导致的电子零件的热机械损坏

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摘要

Tin whiskering is a concern with tin-rich alloy finishes on electronic part terminations. Solder dipping may be used to replace the original finish with eutectic tin—lead solder for tin-whiskering risk mitigation purposes. However, the solder dipping process may expose electronic parts to thermomechanical damage within the package due to the thermal refinishing profile used during dipping. This paper discusses solder dipping as a refinishing technique and the associated risks from thermo mechanical damage. An experimental study was used to assess the possibility of thermomechanical damage on various electronic part-types of different package configurations. Package and die geometries were characterized for all part-types to develop quantitative metrics, which may be used by electronic part users to assess parts for their susceptibility to thermomechanical damage.
机译：对于电子零件终端上的富锡合金表面处理，锡晶须是一个问题。焊料浸渍可用于以共晶锡铅焊料代替原始涂层，以降低锡须风险。但是，由于浸渍过程中使用的热修补轮廓，焊料浸渍工艺可能会使电子零件受到封装内热机械损坏的影响。本文讨论了将焊料浸入作为修补技术以及热机械损坏的相关风险。实验研究用于评估在不同封装配置的各种电子零件类型上发生热机械损坏的可能性。对所有零件类型的封装和模具几何形状进行了表征，以开发量化指标，电子零件用户可以使用它们来评估零件对热机械损伤的敏感性。

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