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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
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Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

机译：使用预先施加的各向异性导电膜（ACF）的晶圆级倒装芯片封装

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摘要

Recently, wafer-level packaging (WLP) has become one of the promising packaging technologies due to its advantages, such as fewer processing steps, lower cost, and enhanced device performance compared to conventional single-chip packaging. Many developments on new WLP design, material, and process have been accomplished according to performance and reliability requirement of the devices to be packaged , . For a lower cost, higher performance, and environmentally green packaging process, anisotropic conductive film (ACF) flip chip assembly has been widely used, such as in ultrafine-pitch flat panel display (FPD) and general semiconductor packaging applications, too. However, there has been no previous attempt on the wafer-level flip chip assembly using ACFs. In this paper, wafer-level flip chip packages using preapplied ACFs were investigated. After ACF prelamination on an electroplated Au bumped wafer, and subsequent singulation, singulated chips were flip-chip assembled on an organic substrate using a thermocompression bonding method. Au-plated bumps were well assembled on Ni/Au pads of organic substrates. The electrical, mechanical properties and the reliabilities of wafer-level flip chip assemblies (WL-FCAs) were evaluated and compared with conventional ACF flip chip assemblies using the thermocompression method. Contact resistance measurement was performed after thermal cycling, high temperature/humidity, and pressure cooker test. ACF joints between electroplated Au bumps and substrate metal pads showed stable contact resistance of 5 ${hbox {m}}Omega $ per a bump, strong bump adhesion, and similar reliability behaviors compared with conventional ACF flip chip joints using a thermocompression bonding. As a summary, new wafer-level packages using preapplied ACFs were successfully demonstrated- for flip chip assembly. The new wafer-level packages using preapplied ACFs can be widely used for many nonsolder flip chip assembly applications such as chip-on-board (COB), chip-on-flex (COF), and chip-on-glass (COG).
机译：近年来，晶圆级封装（WLP）的优势在于，与传统的单芯片封装相比，它具有更少的处理步骤，更低的成本以及增强的器件性能，因而成为一种有前途的封装技术。根据待封装器件的性能和可靠性要求，已经完成了新的WLP设计，材料和工艺方面的许多开发。为了以更低的成本，更高的性能和更环保的绿色封装工艺，各向异性导电膜（ACF）倒装芯片组件已被广泛使用，例如超细间距平板显示器（FPD）和一般的半导体封装应用。但是，以前没有进行过使用ACF的晶圆级倒装芯片组装的尝试。在本文中，研究了使用预先应用的ACF的晶圆级倒装芯片封装。在将ACF预层压在电镀的Au凸点晶片上并进行单片化之后，使用热压键合方法将单片芯片倒装芯片组装在有机基板上。镀金的凸块很好地组装在有机基板的Ni / Au焊盘上。评估了晶圆级倒装芯片组件（WL-FCA）的电学，机械性能和可靠性，并与使用热压法的传统ACF倒装芯片组件进行了比较。在热循环，高温/高湿和高压锅测试之后进行接触电阻测量。与使用热压键合的传统ACF倒装芯片接头相比，电镀Au凸块和基材金属焊盘之间的ACF接头显示每个凸点稳定的接触电阻为5 $ {hbox {m}}Ω，稳定的凸点附着力和相似的可靠性。总而言之，使用倒装芯片组装的新型晶圆级封装已成功演示了使用预先应用的ACF。使用预先应用的ACF的新晶圆级封装可广泛用于许多非焊料倒装芯片组装应用，例如板载芯片（COB），柔性芯片（COF）和玻璃上芯片（COG）。

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