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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques
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Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques

机译：使用基于LCD的相移技术对焊膏进行全场3D测量

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摘要

Quality inspection of deposited solder pastes is critical in surface mounting processes. As surface-mount technology (SMT) component pitches decrease, three-dimensional (3-D) measurement of solder pastes has become more and more important in ensuring solder joint reliability. Currently, the 3-D measurements for solder pastes are mainly performed by laser-based systems. However, they suffer from low inspection speed due to the physical line-scanning process. In this paper, a fast and cost-effective 3-D measurement system for deposited solder pastes is proposed. The proposed system uses a liquid crystal display (LCD)-based phase shifting technique to perform full-field 3-D measurement of solder pastes with high accuracy. Experiments have shown that the 3-D profiling and volume measurement of solder pastes are very efficient and effective with the proposed system. The volume measurement repeatability is in the micrometer range. The processing time of the proposed 3-D measurement system for an image of 640/spl times/480 pixels is less than 1 s on a typical personal computer.
机译：沉积焊膏的质量检查在表面安装过程中至关重要。随着表面贴装技术（SMT）组件间距的减小，焊膏的三维（3-D）测量在确保焊点可靠性方面变得越来越重要。当前，焊膏的3-D测量主要由基于激光的系统执行。但是，由于物理线扫描过程，它们的检查速度很慢。在本文中，提出了一种快速且经济高效的3-D测量系统，用于沉积的焊膏。拟议的系统使用基于液晶显示（LCD）的相移技术来以高精度执行焊膏的全场3-D测量。实验表明，使用所提出的系统，锡膏的3-D轮廓和体积测量非常有效。体积测量的重复性在微米范围内。对于典型的个人计算机，对于640 / spl次/ 480像素的图像，建议的3-D测量系统的处理时间少于1 s。

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