• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Fabrication of microvias for multilayer LTCC substrates
【24h】

Fabrication of microvias for multilayer LTCC substrates

机译：多层LTCC基板的微孔的制造

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Advances in screen printing and photoimageable paste technologies have allowed low-temperature cofired ceramic (LTCC) circuit densities to continue to increase; however, the size of vias for Z-axis interconnections in multilayer LTCC substrates have been a limiting process constraint. In order to effectively exploit the 50-100-/spl mu/m line/spacing capabilities of advanced screen printing and photoimageable techniques, microvia technologies need to achieve 100 /spl mu/m and under in diameter. Three main steps in fabrication of microvias include via formation, via metallization or via fill, and layer-to-layer alignment. The challenges associated with the processing and equipment for the fabrication of microvias are addressed in this paper. Microvias down to 50 /spl mu/m in diameter with spacings as small as 50 /spl mu/m are achieved in 50-254-/spl mu/m-thick LTCC tape layers through the use of a mechanical punching system, whereas the minimum size of 75-/spl mu/m via/spacing is obtained using a pulse laser-drilling system in the LTCC tape layers with the same thicknesses as those for the punching test. The quality of punched microvias and laser-drilled microvias will be presented as well. Layer-to-layer alignment is crucial to the connection of vias in adjacent LTCC tape layers. Through a stack and tack machine with a three-camera vision system and an adjustable precision stage, less than 25-/spl mu/m layer-to-layer misalignment is achieved across a 114.3/spl times/114.3 mm (4.5/spl times/4.5 in) design area. In a six-layer LTCC test substrate (152/spl times/152/spl times/0.762 mm), microvias of 50, 75, and 100 /spl mu/m in diameter are successfully fabricated without the use of via catch pads. The cross section of fired microvias filled with silver conductor pastes at various locations of this substrate demonstrates a minor layer-to-layer misalignment in both X and Y directions across the substrate.
机译：丝网印刷和可光成像的浆料技术的进步使低温共烧陶瓷（LTCC）电路密度得以持续提高。然而，多层LTCC基板中用于Z轴互连的通孔的尺寸一直是工艺的限制。为了有效地利用先进的丝网印刷和光成像技术的50-100- / spl mu / m的线/间距功能，微孔技术需要达到100 / spl mu / m的直径。制造微孔的三个主要步骤包括通孔形成，通孔金属化或通孔填充以及层到层对齐。本文解决了与微孔制造相关的工艺和设备方面的挑战。通过使用机械冲压系统，可以在50-254-spl mu / m厚的LTCC胶带层中实现直径低至50 / spl mu / m且间距小至50 / spl mu / m的微孔。使用脉冲激光钻孔系统在LTCC胶带层中获得的最小厚度为75- / spl mu / m的通孔/间距，其厚度与打孔测试的厚度相同。还将介绍穿孔微孔和激光钻孔微孔的质量。层间对齐对于相邻LTCC胶带层中通孔的连接至关重要。通过具有三摄像机视觉系统和可调精度工作台的叠钉机，在114.3 / spl倍/114.3 mm（4.5 / spl倍）内，层与层之间的错位小于25 / spl /4.5 in）设计区域。在六层LTCC测试基板（152 / spl次/ 152 / spl次/0.762毫米）中，成功制作了直径分别为50、75和100 / splμ/ m的微孔，而无需使用过孔捕获垫。在该衬底的各个位置处填充有银导体浆料的经焙烧的微通孔的横截面在整个衬底的X和Y方向上都显示出较小的层间错位。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号