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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Parametric analysis of steam driven delamination in electronics packages
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Parametric analysis of steam driven delamination in electronics packages

机译：电子封装中蒸汽驱动分层的参数分析

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Steam driven delamination between molding compound and substrate is analytically modeled. Pressure based delamination criterion and steam evaporation based criterion are examined as a function of crack size. Comparison with reported experimental trends revealed that steam based delamination criterion N/sub c/ is more descriptive of the stable and fast fracture regimes in steam driven delamination in electronics packages during solder reflow heat treatment. Following the establishment of the criterion, the driving force for delamination N/sub s/ is modeled. Delamination occurs when N/sub s/ equals or exceeds N/sub c/. Parametric investigations on the influence of molding compound thickness, defect size, elastic modulus, and critical strain energy released rate with and without humidity pre-conditioning were conducted using the analytical model. The study revealed that the critical delamination temperature is controlled by the defect size and the decrease in the critical strain energy released rate resulting from exposure to a humid environment. To minimize steam driven delamination, defect size and water degradation of critical strain energy released rate should be minimized.
机译：分析模型中模塑料和基材之间的蒸汽驱动分层。检查基于压力的分层标准和基于蒸汽蒸发的标准，作为裂纹尺寸的函数。与报告的实验趋势进行比较后发现，基于蒸汽的分层准则N / sub c /更能描述回流焊接热处理过程中电子封装中蒸汽驱动分层的稳定和快速断裂状态。建立标准后，对分层的驱动力N / sub s /进行建模。当N / sub s /等于或超过N / sub c /时发生分层。使用分析模型，对模塑料厚度，缺陷尺寸，弹性模量和有无湿度预处理的临界应变能释放速率的影响进行了参数研究。研究表明，临界分层温度受缺陷尺寸和由于暴露于潮湿环境而导致的临界应变能释放速率降低的控制。为了最小化蒸汽驱动的分层，应最小化缺陷尺寸和临界应变能释放速率的水降解。

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