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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film
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Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film

机译：使用低CTE各向异性导电膜降低有机基板上倒装芯片组装中的热应变

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Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances, resulting in a high performance and cost-competitive packaging method. This paper describes the usefulness of low cost flip-chip assembly using electroless Ni/Au bump and anisotropic conductive films on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed as a low cost bumping method. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with Ni/sub 3/P precipitation above 300/spl deg/C causes an increase of hardness and an increase of the intrinsic stress. As interconnection material, modified ACFs composed of nickel conductive fillers for conductive fillers, and nonconductive fillers for modification of film properties, such as coefficient of thermal expansion (CTE), were formulated for improved electrical and mechanical properties of ACF interconnection. Three ACF materials with different CTE values were prepared and bonded between Si chips and FR-4 boards for the thermal strain measurement using moire interferometry. The thermal strain of the ACF interconnection layer, induced by temperature excursion of 80/spl deg/C, was decreased according to the decreasing CTEs of ACF materials. This result indicates that the thermal fatigue life of ACF flip chip assembly on organic boards, limited by the thermal expansion mismatch between the chip and the board, could be increased by low CTE ACF.
机译：直接在有机板上倒装芯片组装可实现封装尺寸的最小化以及互连距离的减小，从而实现了一种高性能且具有成本竞争力的封装方法。本文介绍了在有机板（例如FR-4）上使用化学镀Ni / Au凸块和各向异性导电膜进行低成本倒装芯片组装的有用性。作为倒装芯片的凸块，进行了化学镀Ni / Au作为低成本的凸块方法。退火对Ni凸点特性的影响表明，当Ni / sub 3 / P析出高于300 / spl℃/ C时，形成结晶镍会导致硬度增加和固有应力增加。作为互连材料，配制了由用于导电填料的镍导电填料和用于改变膜特性（例如热膨胀系数（CTE））的非导电填料组成的改性ACF，以改善ACF互连的电气和机械性能。制备了三种具有不同CTE值的ACF材料，并将其粘合在Si芯片和FR-4板之间，用于使用莫尔干涉仪进行热应变测量。由于ACF材料的CTE降低，由80 / spl deg / C的温度偏移引起的ACF互连层的热应变减小。该结果表明，通过低CTE ACF可以增加有机板上ACF倒装芯片组件的热疲劳寿命（受芯片与板之间的热膨胀不匹配的限制）。

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