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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >A Multilayer LTCC Solution for Integrating 5G Access Point Antenna Modules
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A Multilayer LTCC Solution for Integrating 5G Access Point Antenna Modules

机译:集成5G接入点天线模块的多层LTCC解决方案

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摘要

An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured −10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in -plane can be easily achieved. In the 50–66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in -plane is −20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future -band high data-rate wireless networks.
机译:提出了一种基于低温共烧陶瓷(LTCC)的用于第五代(5G)通信的多层天线模块开发的集成解决方案。该设计利用了LTCC流程的3D集成功能,从而可以在垂直配置中实现全公司的馈送网络(CFN)。提出了一种CFN的新颖实现方式,它采用了嵌入介质的平行平板波导(PPW)。 PPW线由通行分隔。与标准的集成基板的波导馈送网络相反,引导场与通孔正交,并沿结构的垂直轴传播。 CFN馈入四个长槽,没有任何耦合结构,并提供宽带操作。最终的原型包括18片LTCC胶带,总厚度为3.4毫米。测得的-10dB阻抗带宽范围为51.2至66 GHz(> 25.2%)。该模块会产生固定的宽边光束,但是可以轻松实现面内的多光束操作。在50-66 GHz频带中,峰值增益为14.25 dBi,而-平面中的平均第一旁瓣电平为−20.6 dB。所提出的技术和设计概念适用于高度集成的毫米波系统,例如未来频段高数据速率无线网络中的接入点。

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