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Low-resistance ultrashallow extension formed by optimized flash lamp annealing

机译:通过优化的闪光灯退火形成的低电阻超浅延伸

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摘要

Flash lamp annealing (FLA) technology is proposed as a new method of activating implanted impurities. By optimizing FLA and implantation conditions, junction depth (Xj) at the concentration of 1 /spl times/ 10/sup 18/ cm/sup -3/ and the sheet resistance of 13 nm and 700 /spl Omega//sq for As and 14 nm and 770 /spl Omega//sq for BF/sub 2/ with junction leakage lower than 1 /spl times/ 10/sup -16/ A//spl mu/m/sup 2/ at 1.5 V were successfully obtained without wafer slip and warpage problems.
机译:闪光灯退火(FLA)技术被提出作为一种激活注入杂质的新方法。通过优化FLA和注入条件,As和As的结深度(Xj)分别为1 / spl倍/ 10 / sup 18 / cm / sup -3 /和13 nm的薄层电阻和700 / splΩ// sq。成功获得BF / sub 2 /的14 nm和770 / splΩ// sq的BF / sub 2 /,并在1.5 V电压下低于1 / spl次/ 10 / sup -16 / A // spl mu / m / sup 2 /晶圆打滑和翘曲问题。

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