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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Integrated facility layout and material handling system design in semiconductor fabrication facilities
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Integrated facility layout and material handling system design in semiconductor fabrication facilities

机译：半导体制造设施中的综合设施布局和材料处理系统设计

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摘要

Semiconductor manufacturing is an important component of the U.S. manufacturing industry. Most of today's fabrication facilities and those being designed for the near future use a bay layout configuration and an overhead monorail system for moving material between bays. These material handling systems are usually designed with a spine or perimeter type of configuration. This paper investigates the layout and material handling system design integration problem in semiconductor fabrication facilities and proposes a methodology for solving this integrated design problem. A spacefilling curve approach is used to address the facility layout, while the structure of the spine and perimeter configurations are exploited to create a network flow problem to determine the material handling system design. Computational results are presented and show exceptional promise for this procedure in solving the integrated design problem in a semiconductor manufacturing environment.
机译：半导体制造是美国制造业的重要组成部分。如今，大多数制造设施以及为不久的将来而设计的制造设施都使用机架布局配置和高架单轨系统，以在机架之间移动物料。这些材料处理系统通常设计成具有脊柱或周边类型的配置。本文研究了半导体制造设施中的布局和材料处理系统设计集成问题，并提出了解决该集成设计问题的方法。使用空间填充曲线方法解决设施布局问题，同时利用脊柱和外围配置的结构来创建网络流动问题，以确定物料处理系统的设计。提出了计算结果，并显示出此程序在解决半导体制造环境中的集成设计问题方面的特殊前景。

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