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Dynamic response analysis of pyroelectric sensitive element for thermal imaging

机译:热成像热释电敏感元件的动态响应分析

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Temperature distributions under periodic thermal excitations and the responsivity of a pyroelectric device consisting of a cover layer, infrared absorber, metal contact, sensitive pyroelectric element, interconnecting column, and bulk silicon are found. Some results of numerical thermal modeling and analysis of exact expressions for a few extreme cases are presented. Pyroelectric responses of real structures are compared with the response of a single pyroelectric element in air as a limiting case of maximum sensitivity. The analytical approximations and numerical simulation show that the frequency response of the multilayered structure consists of different parts with simple frequency dependencies. In the region of high frequencies of light modulation, the responsivity is proportional to /spl omega//sup -1/, at low frequencies /spl sim/ /spl omega//sup -0.5/, and, in the region of intermediate frequencies, the voltage responsivity is independent of frequency.
机译:发现了周期性热激发下的温度分布以及由覆盖层,红外吸收剂,金属触点,敏感的热电元件,互连柱和块状硅组成的热电器件的响应度。给出了一些极端情况下数值热建模的结果以及精确表达式的分析。将实际结构的热释电响应与空气中单个热释电元件的响应进行比较,以此作为最大灵敏度的极限情况。解析近似和数值模拟表明,多层结构的频率响应由具有简单频率相关性的不同部分组成。在光调制的高频区域,响应度与/ spl omega // sup -1 /成正比,在低频/ spl sim / / spl omega // sup -0.5 /时,以及在中频区域,电压响应与频率无关。

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