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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Interdigital pair bonding for high frequency (20-50 MHz) ultrasonic composite transducers
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Interdigital pair bonding for high frequency (20-50 MHz) ultrasonic composite transducers

机译：用于高频（20-50 MHz）超声复合换能器的叉指对焊接

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摘要

Interdigital pair bonding is a novel methodology that enables the fabrication of high frequency piezoelectric composites with high volume fractions of the ceramic phase. This enhancement in ceramic volume fraction significantly reduces the dimensional scale of the epoxy phase and increases the related effective physical parameters of the composite, such as dielectric constant and the longitudinal sound velocity, which are major concerns in the development of high frequency piezoelectric composites. In this paper, a method called interdigital pair bonding (IPB) is used to prepare a 1-3 piezoelectric composite with a pitch of 40 /spl mu/m, a kerf of 4 /spl mu/m, and a ceramic volume fraction of 81%. The composites prepared in this fashion exhibited a very pure thickness-mode resonance up to a frequency of 50 MHz. Unlike the 2-2 piezoelectric composites with the same ceramic and epoxy scales developed earlier, the anticipated lateral modes between 50 to 100 MHz were not observed in the current 1-3 composites. The mechanisms for the elimination of the lateral modes at high frequency are discussed. The effective electromechanical coupling coefficient of the composite was 0.72 at a frequency of 50 MHz. The composites showed a high longitudinal sound velocity of 4300 m/s and a high clamped dielectric constant of 1111/spl epsiv//sub 0/, which will benefit the development of high frequency ultrasonic transducers and especially high frequency transducer arrays for medical imaging.
机译：叉指对键合是一种新颖的方法，可以制造具有高体积分数陶瓷相的高频压电复合材料。陶瓷体积分数的这种增加显着减小了环氧相的尺寸，并增加了复合材料的相关有效物理参数，例如介电常数和纵向声速，这是高频压电复合材料开发中的主要问题。在本文中，使用一种称为叉指对粘接（IPB）的方法来制备1-3压电复合材料，其间距为40 / spl mu / m，切口为4 / spl mu / m，陶瓷体积分数为81％。以这种方式制备的复合材料在高达50 MHz的频率下表现出非常纯的厚度模式共振。与之前开发的具有相同陶瓷和环氧氧化皮的2-2压电复合材料不同，在当前的1-3复合材料中未观察到预期的50至100 MHz的横向模式。讨论了消除高频侧模的机制。在50 MHz的频率下，复合材料的有效机电耦合系数为0.72。该复合材料显示出4300 m / s的高纵向声速和1111 / spl epsiv // sub 0 /的高钳位介电常数，这将有利于开发高频超声换能器，尤其是用于医学成像的高频换能器阵列。

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