Effects of package parasitics on the performance of SAW filters

Jatkar D.D.; Beker B.

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Effects of package parasitics on the performance of SAW filters

机译：封装寄生效应对声表面波滤波器性能的影响

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Effects of package parasitics on the performance of SAW filters were evaluated. A quasi-static approach based on the finite difference method (FDM) in conjunction with the current simulation method (CSM) was used to extract lumped element parameter values of common interconnections that are found in typical SAW packages. The influence of bond wire connections and package leads on the performance of common interdigital transducers (IDTs) was evaluated.

机译：评估了封装寄生效应对SAW滤波器性能的影响。基于有限差分法（FDM）和当前仿真方法（CSM）的准静态方法用于提取常见SAW封装中常见互连的集总元素参数值。评估了键合线连接和封装引线对普通叉指式换能器（IDT）性能的影响。

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《IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control》 |1996年第6期|P.1187-1194|共8页
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Jatkar D.D.; Beker B.;
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正文语种 eng
中图分类声学工程;
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专利

1. Effects of package parasitics on the performance of SAW filters [J] . Jatkar D.D., Beker B. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control . 1996,第6期

机译：封装寄生效应对声表面波滤波器性能的影响
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3. Effects of Interactions Between Filter Parasitics and Power Interconnects on EMI Filter Performance [J] . Shuo Wang, van Wyk J.D., Lee F.C. IEEE Transactions on Industrial Electronics . 2007,第6期

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4. Effects of Interactions between Filter Parasitics and Power Interconnects on EMI Filter Performance [C] . Shuo Wang, Jacobus Daniel van Wyk, Fred. C. Lee 2006 CPES(Center for Power Electronics Systems) Power Electronics Conference Proceedings . 2006

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Effects of package parasitics on the performance of SAW filters

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