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首页> 外文期刊>IEEE Transactions on Industrial Electronics >Accuracy Analysis of Dynamic-Wafer-Handling Robotic System in Semiconductor Manufacturing
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Accuracy Analysis of Dynamic-Wafer-Handling Robotic System in Semiconductor Manufacturing

机译：半导体制造中动态晶圆处理机器人系统的精度分析

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摘要

Wafer-handling robots are widely used to transfer wafers in semiconductor manufacturing. To improve the wafer transfer efficiency, optic sensors are installed at each station to estimate the wafer eccentricity on the fly. However, due to nonideal factors such as light beam radius, robot motion error, and system nonlinearity and uncertainties, it is difficult to achieve high-accuracy eccentricity estimation to satisfy the demanding requirements in semiconductor manufacturing. To further improve the eccentricity estimation accuracy, the relationship among the robot kinematic error, sensor calibration error, and eccentricity identification error is analyzed. The analytic results show that both the error modeling method and the global data sampling method can greatly improve the wafer eccentricity estimation accuracy. The proposed eccentricity estimation techniques are verified by experiments performed on a wafer-handling robotic system. The results demonstrate that the developed methods can be used to improve the wafer-handling accuracy and reduce the wafer-handling cycle time in semiconductor manufacturing.
机译：晶圆处理机器人广泛用于半导体制造中的晶圆转移。为了提高晶片传输效率，在每个工位都安装了光学传感器，以动态估算晶片的偏心率。但是，由于光束半径，机械手运动误差，系统非线性和不确定性等非理想因素，难以实现高精度的偏心率估算以满足半导体制造中的苛刻要求。为了进一步提高偏心率估计的准确性，分析了机器人运动学误差，传感器校准误差和偏心率识别误差之间的关系。分析结果表明，误差建模方法和全局数据采样方法都可以大大提高晶片偏心率估计的准确性。通过在晶圆处理机器人系统上进行的实验验证了所提出的偏心率估算技术。结果表明，所开发的方法可用于提高晶片制造中的晶片处理精度并减少晶片处理周期。

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