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Dynamic data split: A crosstalk suppression scheme in TSV-based 3D IC

机译：动态数据拆分：基于TSV的3D IC中的串扰抑制方案

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摘要

Through-silicon via (TSV) technology improves transmission bandwidth in three-dimensional integrated circuits (3D ICs) due to its short connection path. However, it is limited by crosstalk issues, especially in closely spaced TSV clusters. The present study proposed a cost-effective scheme called the "dynamic data split" for optimization. The presented scheme was compared with other schemes, and its memory access requests from the L1 cache to L2 cache were examined using benchmarks such as SPEC2006Int. The proposed scheme presented the best bandwidth improvement at a minimal cost, i.e., it achieved a 15.75% improvement on requests for instruction fetches, in contrast to the 7.01% improvement observed in other dynamic mapping schemes.
机译：穿硅通孔（TSV）技术由于其较短的连接路径而提高了三维集成电路（3D IC）的传输带宽。但是，它受到串扰问题的限制，尤其是在间隔很小的TSV群集中。本研究提出了一种经济有效的方案，称为“动态数据拆分”以进行优化。将该方案与其他方案进行了比较，并使用诸如SPEC2006Int之类的基准检查了从L1缓存到L2缓存的内存访问请求。所提出的方案以最小的成本提供了最佳的带宽改进，即，与其他动态映射方案中观察到的7.01％的改进相比，它在指令提取请求方面实现了15.75％的改进。

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  • 来源
    《Integration》 |2017年第9期|23-30|共8页
  • 作者

    Wang Qin; Chen Zhenyang; Jiang Jianfei; Guo Zheng; Mao Zhigang;

  • 作者单位

    Shanghai Jiao Tong Univ, Dept Microelect & Nanosci, 800 Dong Chuan Rd, Shanghai 200240, Peoples R China;

    Intel Asia Pacific Res & Dev Ctr, 880 Zi Xing Rd, Shanghai 200241, Peoples R China;

    Shanghai Jiao Tong Univ, Dept Microelect & Nanosci, 800 Dong Chuan Rd, Shanghai 200240, Peoples R China;

    Shanghai Jiao Tong Univ, Dept Microelect & Nanosci, 800 Dong Chuan Rd, Shanghai 200240, Peoples R China;

    Shanghai Jiao Tong Univ, Dept Microelect & Nanosci, 800 Dong Chuan Rd, Shanghai 200240, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    TSV; Crosstalk suppression; Mapping; 3D IC;

    机译：TSV;串扰抑制;映射;3D IC;

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