• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>International journal of automation technology >Flexible Fiber Conditioner for Fine Conditioning of Polishing Pad and its Evaluation in Chemical Mechanical Polishing: Verification of SUS-FFC on Soft Urethane Foam Pad and Proposal of PEEK-FFC
【24h】

Flexible Fiber Conditioner for Fine Conditioning of Polishing Pad and its Evaluation in Chemical Mechanical Polishing: Verification of SUS-FFC on Soft Urethane Foam Pad and Proposal of PEEK-FFC

机译：柔性纤维调节剂，用于抛光垫的精细调节及其在化学机械抛光中的评价：SUS-FFC验证软氨基甲酸酯泡沫垫及PEEK-FFC的建议

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Polishing pad conditioning is essential for achieving stable chemical mechanical polishing (CMP). While diamond disk conditioners (DDCs) are often applied, flexible fiber conditioners (FFCs) have been proposed as a new conditioning tool. FFCs are intended for roughening the pad surface appropriately by bundling fine wire fibers. Our previous study demonstrated the fine conditioning characteristics of FFCs for a hard urethane foam pad. In this study, the conditioning characteristics of an FFC are compared with those of a DDC. First, we evaluate the conditioning performance of an FFC using SUS fibers on a soft urethane foam pad. The result indicates that on a soft pad, the SUS-FFC can restore the pad surface asperities more finely, as confirmed via the stabilized number of contact points based on contact image and luminance value distribution analyses. Subsequently, for a metal-contamination-free FFC process intended for semiconductor CMP, we develop an FFC fabricated using polyether ether ketone (PEEK) and verify its performance via the CMP test of a silicon oxide film. It is shown that the hard pad can be conditioned using the developed PEEK-FFC; this implies that a stable removal rate can be realized immediately after pad break-in conditioning.
机译：抛光焊盘调节对于实现稳定的化学机械抛光（CMP）至关重要。虽然通常应用钻石磁盘调节器（DDC），但已提出柔性光纤调节器（FFC）作为新的调节工具。 FFC旨在通过捆绑细线纤维适当地粗略垫表面。我们以前的研究表明，用于硬质氨基甲酸酯泡沫垫的FFCS的精细调节特性。在该研究中，将FFC的调节特性与DDC的调节特性进行比较。首先，我们在柔软的聚氨酯泡沫垫上使用SUS纤维评估FFC的调理性能。结果表明，在软垫上，SUS-FFC可以更精细地恢复焊盘表面，如通过基于接触图像和亮度值分布分析的稳定的接触点确认。随后，对于用于半导体CMP的无污染的FFC方法，我们开发使用聚醚醚酮（PEEK）制造的FFC，并通过氧化硅膜的CMP测试验证其性能。结果表明，可以使用开发的PEEK-FFC调节硬垫;这意味着可以在垫断裂调节之后立即实现稳定的去除速率。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号