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Enhanced boiling heat transfer on binary surfaces

机译:增强二元表面上的沸腾传热

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摘要

A novel idea for the improvement of boiling heat transfer is that of a binary surface - where a non-boiling liquid coats sub-surface irregularities and aids in heat transfer to the primary working fluid. The threefold goal of this effort was to: (i) prepare durable, low-cost, scalable binary surfaces for boiling heat transfer enhancement, (ii) conduct pool boiling experiments on these surfaces, and (iii) derive the physical mechanisms perceived as responsible for the observed boiling enhancements. Accordingly, robust binary surfaces were prepared on copper using a facile, scalable bulk micro-manufacturing approach. These surfaces consist of numerous micro-ano-cavities filled by a non-boiling liquid creating puddles around solid islands. Boiling experiments were carried out using a dielectric liquid, PF-5060, as the primary working fluid (the boiling liquid). It was observed that, compared to a smooth/plain copper surface, a binary copper surface, with water as the NBL, was able to simultaneously enhance the maximum heat flux limit by ∼2.2 times and the average heat transfer coefficient by ∼7.5 times. A maximum heat flux of 35.06 W/cm~2 was recorded, which is higher than the enhancements reported so far in literature for the pool boiling of PF-5060 on any enhanced surface. It was further found that decreasing the contact angle of the non-boiling liquid on the binary surface enhances both the heat transfer coefficient and the maximum heat flux limit.
机译:改善沸腾传热的一个新想法是二元表面的想法-一种非沸腾的液体覆盖了地下不规则表面,并有助于将热量传给主要工作流体。这项工作的三重目标是:(i)准备耐用,低成本,可扩展的二元表面以增强沸腾传热,(ii)在这些表面上进行池沸腾实验,并且(iii)得出被认为是负责任的物理机制。对于观察到的沸腾增强。因此,使用一种容易的,可扩展的批量微制造方法在铜上制备了坚固的二元表面。这些表面由许多微/纳米腔组成,这些腔中充满了非沸腾的液体,从而在固态岛周围形成了水坑。使用电介质液体PF-5060作为主要工作流体(沸腾液体)进行沸腾实验。观察到,与光滑/普通的铜表面相比,以水为NBL的二元铜表面能够同时将最大热通量极限提高约2.2倍,将平均传热系数提高约7.5倍。记录的最大热通量为35.06 W / cm〜2,高于迄今为止在任何增强表面上PF-5060池沸腾的文献中报道的增强作用。进一步发现,减小非沸腾液体在二元表面上的接触角既提高了传热系数又提高了最大热通量极限。

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