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首页> 外文期刊>International Journal of Heat and Mass Transfer >Correlations highlighting effects of the PCB's Copper ratio on the free convective heat transfer for a tilted QFN32 electronic package
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Correlations highlighting effects of the PCB's Copper ratio on the free convective heat transfer for a tilted QFN32 electronic package

机译：相关性凸显了PCB铜比对倾斜QFN32电子封装的自由对流传热的影响

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摘要

The main objective of this work is to examine the effects of the Copper ratio constituting the upper face of a tilted Printed Circuit Board (PCB) on the natural convective heat transfer concerning an electronic equipment containing a quad flat non-lead type (QFN32) package. Calculations are done by means of the finite volume method for several positions of electronic device on the PCB which is inclined with respect to the horizontal at an angle ranging from 0° (horizontal position) to 90° (vertical position) with a step of 15°. The power generated by the QFN32 varies between 0.1 and 0.8 W, and 10 Copper ratio varying between 0.26% and 39.45% are considered. These ranges correspond to the normal operating of the active electronic device for the intended applications. The study shows that the thermal behavior of the distinct areas of the active package is affected by the Copper ratio. Correlations are proposed, allowing determination of the average convective heat transfer coefficient on the different areas of the QFN32 device, according to the considered values of the Copper ratio, the PCB's inclination angle and the generated power. They optimize its design while controlling its temperature during operation. The results of this survey provide a better modeling of this conventional arrangement widely used in electronic applications.
机译：这项工作的主要目的是检查构成倾斜印刷电路板（PCB）上表面的铜比对包含四方扁平无铅（QFN32）封装的电子设备的自然对流传热的影响。 。通过有限体积方法，对电子设备在PCB上相对于水平线倾斜的多个位置（以0°（水平位置）到90°（垂直位置）的角度）进行计算，步长为15 °。 QFN32产生的功率在0.1到0.8 W之间变化，并且考虑10铜比在0.26％到39.45％之间变化。这些范围对应于预期应用的有源电子设备的正常运行。研究表明，有源封装不同区域的热行为受铜比的影响。提出了相关性，从而可以根据考虑的铜比，PCB的倾斜角和产生的功率来确定QFN32器件不同区域的平均对流传热系数。他们在操作过程中控制温度的同时优化了其设计。这项调查的结果为广泛应用于电子应用中的这种常规布置提供了更好的模型。

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