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Significant heat transfer enhancement in microchannels with herringbone-inspired microstructures

机译:人字形启发的微结构显着增强了微通道中的传热

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摘要

Herringbone microstructures are a very promising class of flow promoters to passively enhance heat transfer in microchannels by efficiently triggering helicoidal fluid motion. A host of applications are envisioned to benefit from heat transfer enhancement in microchannels, including microfluidic inter-layer cooling of 3D electronic chip stacks, or advanced concepts of integrated cooling and electrochemical power delivery. Here we investigate the cooling performance of microchannels with such flow promoters and show that the Nusselt number reaches an average value of Nu = 36.6 at a Reynolds number of Re = 510 for our best performing design. This result constitutes a fourfold improvement in heat transfer capability compared to a plain microchannel. The fluid temperature is assessed optically using micron-resolution laser induced fluorescence (μLIF), while the wall temperature is measured with on-chip resistance thermometers. In addition, we determine the pressure drop originating from the presence of the herringbone flow promoters. By taking into account both the beneficial heat transfer enhancement and the adverse increase of pressure drop in a non-dimensional figure of merit (FoM), we demonstrate a significant performance enhancement of 220% at Re = 350 using herringbone structures for heat transfer augmentation compared to a plain, unstructured reference microchannel.
机译:人字形微结构是一类非常有前途的流动促进剂,通过有效触发螺旋状流体运动来被动增强微通道中的传热。可以预见到许多应用程序将从微通道中的传热增强中受益,包括3D电子芯片堆栈的微流体层间冷却,或集成冷却和电化学功率输送的高级概念。在这里,我们研究了具有此类流动促进剂的微通道的冷却性能,结果表明,为达到最佳性能,努塞尔数在Re = 510的雷诺数下达到Nu = 36.6的平均值。与普通的微通道相比,该结果构成了传热能力的四倍提高。使用微米级分辨率的激光诱导荧光(μLIF)光学评估流体温度,同时使用片上电阻温度计测量壁温。另外,我们确定了由于人字形流动促进剂的存在而引起的压降。通过在无量纲品质因数(FoM)中考虑到有益的传热增强和压降的不利增加,我们证明了使用人字形结构进行传热增强时,在Re = 350时性能显着提高了220%到一个普通的,非结构化的参考微通道。

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    Laboratory of Thermodynamics in Emerging Technologies, Department of Mechanical and Process Engineering, ETH Zuerich, 8092 Zuerich, Switzerland,IBM Research Zurich, Saeumerstrasse 4, 8803 Rueschlikon, Switzerland;

    Laboratory of Thermodynamics in Emerging Technologies, Department of Mechanical and Process Engineering, ETH Zuerich, 8092 Zuerich, Switzerland;

    Laboratory of Thermodynamics in Emerging Technologies, Department of Mechanical and Process Engineering, ETH Zuerich, 8092 Zuerich, Switzerland;

    IBM Research Zurich, Saeumerstrasse 4, 8803 Rueschlikon, Switzerland;

    IBM Research Zurich, Saeumerstrasse 4, 8803 Rueschlikon, Switzerland;

    Laboratory of Thermodynamics in Emerging Technologies, Department of Mechanical and Process Engineering, ETH Zuerich, 8092 Zuerich, Switzerland;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
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  • 正文语种 eng
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