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Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials

机译:转移垂直排列的碳纳米管阵列作为热界面材料的表征

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摘要

In this study, a solder-carbon nanotube composite thermal interface material (TIM) was fabricated using vertically-aligned carbon nanotubes (VACNTs). The constructed TIM consisted of vertically-aligned carbon nanotube arrays, which were grown on silicon by chemical vapor deposition (CVD) process and then transferred from the growth substrate and soldered to copper disks on both sides via a bismuth/ tin/silver solder. The thermal performance potential of the produced sample as a TIM was measured using ASTM D5470 standard methodology. The interfacial thermal resistance of the transferred CNT-solder composite was examined and reported for pressures of 20 psi and 50 psi. The average thermal resistance value recorded for the constructed sample was 0.458 cm~2-K/W at a pressure of 20 psi and 0.425 cm~2-K/W at a pressure of 50 psi.
机译:在这项研究中,使用垂直排列的碳纳米管(VACNTs)制造了焊料-碳纳米管复合热界面材料(TIM)。构造的TIM由垂直排列的碳纳米管阵列组成,该碳纳米管阵列通过化学气相沉积(CVD)工艺在硅上生长,然后从生长衬底转移并通过铋/锡/银焊料在两侧焊接到铜盘上。使用ASTM D5470标准方法测量生产的样品作为TIM的热性能潜力。检查了转移的CNT-焊料复合材料的界面热阻,并报告了20 psi和50 psi的压力。对于所构造的样品,在20psi的压力下记录的平均热阻值为0.458cm 2 -K / W,在50psi的压力下为0.425cm 2 -K / W。

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