Analysis of critical thermal issues in 3D integrated circuits

著录项

• 来源
  《International Journal of Heat and Mass Transfer》 |2016年第6期|337-352|共16页
• 作者

  Fatemeh Tavakkoli; Siavash Ebrahimi; Shujuan Wang; Kambiz Vafai;

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• 作者单位

  Department of Mechanical Engineering, University of California, Riverside, CA 92521, USA;

  Department of Mechanical and Aerospace Engineering, University of California, Irvine, CA 92697, USA;

  Department of Mechanical Engineering, University of California, Riverside, CA 92521, USA;

  Department of Mechanical Engineering, University of California, Riverside, CA 92521, USA;

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• 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  3D integrated circuits; Thermal issues; Hot spots; Thermal management;

  机译：3D集成电路;散热问题;热点;热管理;