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首页> 外文期刊>International Journal of Heat and Mass Transfer >Capacitive sensing of local bond layer thickness and coverage in thermal interface materials
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Capacitive sensing of local bond layer thickness and coverage in thermal interface materials

机译：电容感应热界面材料中的局部粘结层厚度和覆盖范围

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摘要

An instrumentation technique is developed using embedded capacitive sensors to measure the thickness and evenness of coverage of a thin layer of dielectric thermal interface material (TIM) between two substrates. The technique requires an array of sensors embedded into one substrate, with an electrically conductive opposing substrate. Local capacitance measurements are sensitive to both local bond layer thickness and local voiding. We propose a means for using an array of capacitance measurements to interpret both bond layer thickness and local voiding at every sensor location. An algorithm is developed which reveals both characteristics from a single set of capacitance measurements. Experiments are conducted with thermal grease layers of different bond layer thicknesses and void distributions using a prototype system constructed on printed circuit boards. The thickness and void distribution are successfully mapped across the bond layer using the algorithm developed. The technique offers a sensing approach for in situ instrumentation of layers of thermal grease in a thermal test vehicle.
机译：使用嵌入式电容传感器开发了一种仪器技术，用于测量两个基板之间的电介质热界面材料（TIM）薄层的覆盖厚度和均匀度。该技术需要将传感器阵列嵌入一个基板中，并带有一个相对的导电基板。局部电容测量对局部键合层厚度和局部空隙均敏感。我们提出了一种使用电容测量阵列来解释每个传感器位置处的粘结层厚度和局部空隙的方法。开发了一种算法，该算法从一组电容测量中揭示了这两个特性。使用在印刷电路板上构建的原型系统，对具有不同粘合层厚度和空隙分布的导热油脂层进行了实验。使用开发的算法，可以成功地在整个粘结层上绘制厚度和空隙分布。该技术提供了一种在热测试车中现场检测导热油脂层的传感方法。

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