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首页> 外文期刊>International Journal of Heat and Mass Transfer >A molecular dynamics study on thermal conductivity of thin epoxy polymer sandwiched between alumina fillers in heat-dissipation composite material
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A molecular dynamics study on thermal conductivity of thin epoxy polymer sandwiched between alumina fillers in heat-dissipation composite material

机译：散热复合材料中夹在氧化铝填料之间的环氧聚合物的导热系数的分子动力学研究

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摘要

The composite of epoxy polymers and a-alumina fillers is used as a heat dissipation material. The fillers often agglomerate with nanometer-depth polymers sandwiched in between. We address theoretically the effective thermal conductivity of such a filler-polymer-filler system. The non-equilibrium molecular dynamics simulation is performed to obtain the effective thermal conductivity of the system, in which bisphenol-A (bisA) epoxy polymer sub-system with depth 14-70 A is inserted between two a-alumina slabs. Effects of surface-coupling (SC) agent are also investigated by adding model molecules to the polymer sub-system. For smaller polymer-depth cases, the effective thermal conductivity is determined essentially by the interfacial thermal conductance that relates to the temperature-gaps at the interfaces. We find for the interfacial thermal conductance that: (ⅰ) it is decreased by decreasing the polymer depth toward the chain length of a single bisA molecule, and (ⅱ) it is increased by adding the SC molecules to the polymer sub-system. Combining separate simulation analyses, we show that the (ⅰ) results from effectively weakened interaction between a bisA molecule and two a-alumina slabs due to the orientation constraint on the bisA molecule by the slabs. Reasons of the (ⅱ) are enhancement of the following three quantities by addition of the SC molecules: the phonon population of the bisA molecules at those frequencies corresponding to that of acoustic phonons of a-alumina, the phonon transmission coefficient from the a-alumina slab to the polymer sub-system for the transverse acoustic phonon, and the group velocity of the transverse acoustic phonon in the polymer sub-system.
机译：环氧聚合物和α-氧化铝填料的复合材料用作散热材料。填料经常与夹在其间的纳米深度聚合物附聚。我们从理论上解决了这种填料-聚合物-填料系统的有效导热系数。进行非平衡分子动力学模拟以获得系统的有效导热率，其中将深度为14-70 A的双酚A（bisA）环氧聚合物子系统插入两个a-氧化铝板之间。通过将模型分子添加到聚合物子系统中，还研究了表面偶联（SC）剂的作用。对于较小的聚合物深度情况，有效的热导率基本上由与界面处的温度差有关的界面热导来确定。对于界面热导，我们发现：（ⅰ）通过减小朝向单个bisA分子链长的聚合物深度来减小，并且（ⅱ）通过将SC分子添加到聚合物子系统中来增加。结合单独的模拟分析，我们显示（ⅰ）是由于bisA分子与两个a-氧化铝板之间的相互作用受到有效弱化的结果，这归因于bisA分子对板的取向限制。 （ⅱ）的原因是通过添加SC分子增加了以下三个数量：bisA分子的声子种群在与a-氧化铝的声子对应的那些频率下，来自a-氧化铝的声子传输系数平板到横波声子的聚合物子系统，以及横波声子在聚合物子系统中的群速度。

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  • 来源
    《International Journal of Heat and Mass Transfer》 |2015年第10期|714-723|共10页
  • 作者

    Kouichi Tanaka; Shuji Ogata; Ryo Kobayashi; Tomoyuki Tamura; Takahisa Kouno;

  • 作者单位

    DENSO CORPORATION, 1-1 Showa-cho, Kariya, Aichi 448-8661, Japan,Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho, Nagoya, Aichi 466-8555, Japan;

    Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho, Nagoya, Aichi 466-8555, Japan;

    Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho, Nagoya, Aichi 466-8555, Japan;

    Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho, Nagoya, Aichi 466-8555, Japan;

    Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho, Nagoya, Aichi 466-8555, Japan,Institute for Solid State Physics, The University of Tokyo, 5-1-5 Kashiwanoha, Kashiwa, Chiba 277-8581, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Thermal conductivity; Molecular dynamics; Epoxy polymer; Alumina; Heat dissipation material; Composite material;

    机译：导热系数;分子动力学;环氧聚合物;氧化铝;散热材料;复合材料;

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