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International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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1.
Model order reduction as an integral part of e-mobility development process
机译:
减少模型订单是电动汽车开发过程不可或缺的一部分
作者:
Thomas Iberer
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Solid modeling;
Systems simulation;
Mathematical model;
Thermal conductivity;
Power electronics;
Electromagnetics;
Three-dimensional displays;
2.
Thermal expansion multi physic simulation methodology for LED headlamps
机译:
LED前照灯的热膨胀多物理场仿真方法
作者:
H. Mechmeche
;
Y. Cheng
;
C. Roucoules
;
D. Vilette
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Optical beams;
Thermal expansion;
Optical variables control;
Optical reflection;
Shape;
Optical films;
Deformable models;
3.
Life prediction of lead alloy based on multi-failure criteria
机译:
基于多失效准则的铅合金寿命预测
作者:
Krystian Jankowski
;
Artur Wymysłowski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Reliability;
Fatigue;
Metals;
Creep;
Soldering;
Pins;
Force;
4.
Investigation and optimization of microfluidic flow-through chambers for homogeneous reaction space
机译:
用于均匀反应空间的微流过腔的研究和优化
作者:
Péter Pálovics
;
Márta Rencz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Geometry;
Suspensions;
Simulation;
Microfluidics;
Computational fluid dynamics;
Boundary conditions;
5.
Analyzing delamination in ASIC packages
机译:
分析ASIC封装中的分层
作者:
G. Pecanac
;
C. Silber
;
K. Kosbi
;
L. Vollmer
;
M. Wiedenmann
;
T. von Bargen
;
A. Fischer
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Delamination;
Microelectronics;
Analytical models;
Finite element analysis;
Scanning electron microscopy;
Color;
6.
Packaging effects on Q factor of MEMS resonator
机译:
封装对MEMS谐振器Q因子的影响
作者:
Kisoo Shin
;
Do-Hwan Park
;
Seungoh Han
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Q-factor;
Micromechanical devices;
Temperature;
Energy loss;
Temperature dependence;
Acoustic waves;
7.
Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system
机译:
芯片实验室系统中集成加热器配置的温度分布研究
作者:
Petra Streit
;
Joerg Nestler
;
Robert Schulze
;
Alexey Shaporin
;
Thomas Otto
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Temperature distribution;
Biosensors;
Temperature sensors;
Resistance heating;
Current measurement;
8.
Effect of voids on crack propagation in AuSn die attach for high-temperature power modules
机译:
空隙对高温功率模块AuSn芯片附着中裂纹扩展的影响
作者:
F. Arabi
;
L. Theolier
;
T. Youssef
;
M. Medina
;
J.-Y. Deletage
;
E. Woirgard
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Thermal resistance;
Finite element analysis;
Aging;
Temperature measurement;
Thermal analysis;
9.
Experimental determination of the Young's modulus of various electronic packaging materials
机译:
各种电子包装材料的杨氏模量的实验测定
作者:
F. Kraemer
;
M. Roellig
;
R. Metasch
;
S. Wiese
;
J. Al Ahmar
;
K. Meier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Ultrasonic variables measurement;
Young's modulus;
Acoustics;
Copper;
Strain;
Loading;
10.
The onset of plastic flow in copper materials used for rigid and flexible PCB
机译:
用于刚性和柔性PCB的铜材料中开始出现塑性流动
作者:
S. Wiese
;
F. Kraemer
;
J. Al Ahmar
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Copper;
Plastics;
Strain;
Stress;
Data models;
Crystals;
Production;
11.
Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study
机译:
功能化石墨烯-聚合物纳米复合材料的导热系数:非平衡分子动力学研究
作者:
Hongyu Tang
;
Huaiyu Ye
;
Xianping Chen
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Thermal conductivity;
Graphene;
Conductivity;
Plastics;
Hydrocarbons;
Polyethylene;
Heat sinks;
12.
Prognostics and health monitoring of electronic system: A review
机译:
电子系统的预测和健康监控:回顾
作者:
Alexandru Prisacaru
;
Przemyslaw Jakub Gromala
;
Mateus Bagetti Jeronimo
;
Bongtae Han
;
Guo Qi Zhang
会议名称:
《》
|
2017年
关键词:
Prognostics and health management;
Consumer electronics;
Sensor systems;
Monitoring;
Reliability;
Data models;
13.
Predictive reliability with signal based meta-models
机译:
基于信号的元模型的预测可靠性
作者:
Stephanie Kunath
;
Veit Bayer
;
Roland Niemeier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Computational modeling;
Actuators;
Analytical models;
Predictive models;
Testing;
Shape;
Biological system modeling;
14.
Fracture probability of MLCC in dependence of solder fillet height
机译:
MLCC的断裂概率与焊锡高度的关系
作者:
Joseph Al Ahmar
;
Erik Wiss
;
Steffen Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Capacitors;
Force;
Ceramics;
Soldering;
Lead;
Microelectronics;
Conductivity;
15.
The intriguing electronic and optical properties modulation in blue phosphorene/g-III-nitrides heterostructures
机译:
蓝色磷/ g-III-氮化物异质结构中有趣的电子和光学性质调制
作者:
Qun Yang
;
Chunjian Tan
;
Huaiyu Ye
;
Xianping Chen
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Photonic band gap;
Optical polarization;
Two dimensional displays;
Lattices;
Tensile strain;
Adsorption;
16.
Characterization of thermal conductivity in polymer composite heat exchanger parts
机译:
聚合物复合换热器零件的导热系数表征
作者:
Ismail Darawsheh
;
Antoine Diana
;
Peter Rodgers
;
Valerie Eveloy
;
Fahad Almaskari
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Polymers;
Heat transfer;
Conductivity;
Injection molding;
Tensile stress;
Geometry;
17.
Considerations on pre-stress in a 3D-printed capacitive force/pressure sensor
机译:
3D打印电容式力/压力传感器中预应力的考虑
作者:
Lisa-Marie Faller
;
Hubert Zangl
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Force;
Robot sensing systems;
Electrodes;
Finite element analysis;
Load modeling;
Steel;
18.
Adsorption of gases on monolayer GeSe: A first principle study
机译:
气体在单层GeSe上的吸附:第一个原理研究
作者:
Lian Liu
;
Qun Yang
;
Huaiyu Ye
;
Xianping Chen
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Adsorption;
Charge transfer;
Gases;
Ground penetrating radar;
Geophysical measurement techniques;
Atomic layer deposition;
Graphene;
19.
Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components
机译:
模拟单粒无铅焊点对球栅阵列组件可靠性的影响
作者:
Andreas Lövberg
;
Per-Erik Tegehall
;
Göran Wetter
;
Klas Brinkfeldt
;
Dag Andersson
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Soldering;
Strain;
Crystals;
Tin;
Temperature dependence;
Microstructure;
20.
Robust design optimization: On methodology and short review
机译:
强大的设计优化:方法论和简短回顾
作者:
E. Bektas
;
K. Broermann
;
G. Pećanac
;
S. Rzepka
;
C. Silber
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Robustness;
Design optimization;
Integrated circuits;
Uncertainty;
Numerical models;
Standards;
21.
Strength characterization of TEOS and FTEOS interlayer dielectric materials to compare fracture risk in die stack by 3D FE simulation approach
机译:
TEOS和FTEOS层间介电材料的强度表征,以通过3D FE模拟方法比较芯片堆叠中的断裂风险
作者:
Nishant Lakhera
;
Jim Howell
;
Scott Kipperman
;
Evan Welsh
;
Ilko Schmadlak
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Delamination;
Adhesives;
Load modeling;
Films;
Metals;
Three-dimensional displays;
22.
Uncertainty quantification in polysilicon MEMS through on-chip testing and reduced-order modelling
机译:
通过片上测试和降阶建模对多晶硅MEMS中的不确定度进行量化
作者:
Ramin Mirzazadeh
;
Saeed Eftekhar Azam
;
Eelco Jansen
;
Stefano Mariani
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Micromechanical devices;
Uncertainty;
Numerical models;
Rotors;
Fabrication;
Sensors;
Stators;
23.
Transient thermal simulation of high power LED and its challenges
机译:
大功率LED的瞬态热仿真及其挑战
作者:
Sanchit Tandon
;
E Liu
;
Thomas Zahner
;
Sebastian Besold
;
Wolfgang Kalb
;
Gordon Elger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Light emitting diodes;
Boundary conditions;
Transient analysis;
Solid modeling;
Heat transfer;
Electrical resistance measurement;
24.
Thermo-mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing
机译:
通过熔融沉积建模和蒸汽平滑制造的ABS零件的热机械性能
作者:
Sung-Uk Zhang
;
Jonghyeuk Han
;
Hyun-Wook Kang
;
Byoung-Chul Shin
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Smoothing methods;
Temperature measurement;
Three-dimensional displays;
Frequency division multiplexing;
Temperature dependence;
Three-dimensional printing;
Mechanical factors;
25.
A practical application of the response surface methodology to power electronics failure prediction
机译:
响应面法在电力电子设备故障预测中的实际应用
作者:
A. Renaud
;
E. Woirgard
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Strain;
Aging;
Response surface methodology;
Data models;
Monitoring;
Temperature measurement;
Substrates;
26.
Theoretical and experimental study of thermal resistance temperature distribution in high-power AlGaInN LED arrays
机译:
大功率AlGaInN LED阵列热阻和温度分布的理论和实验研究。
作者:
A.E. Chernyakov
;
A.V. Aladov
;
A.L. Zakgeim
;
M.N. Mizerov
;
V.M. Ustinov
;
I.A. Kalashnikov
;
A.A. Gavrikov
;
V.I. Smirnov
;
V.A. Sergeev
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Light emitting diodes;
Temperature measurement;
Thermal resistance;
Temperature distribution;
Heating systems;
Current measurement;
27.
Design and simulation of a 2-bit distributed S-band MEMS phase shifter
机译:
2位分布式S带MEMS移相器的设计与仿真
作者:
Noor Amalina Ramli
;
Tughrul Arslan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Phase shifters;
Micromechanical devices;
Coplanar waveguides;
Capacitance;
Phased arrays;
Capacitors;
28.
A PoF and statistics combined reliability prediction for LED arrays in lamps
机译:
PoF和统计结合的灯具中LED阵列的可靠性预测
作者:
Bo Sun
;
Xuejun Fan
;
Jiajie Fan
;
Cheng Qian
;
G.Q. Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Light emitting diodes;
Light sources;
Junctions;
Reliability;
Temperature distribution;
Predictive models;
Temperature dependence;
29.
Towards high fidelity silicon microphones: Evaluating the potential of industrial microsystems applying tailored system-level models
机译:
迈向高保真硅麦克风:使用量身定制的系统级模型评估工业微系统的潜力
作者:
G. Schrag
;
T. Künzig
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Microphones;
Atmospheric modeling;
Integrated circuit modeling;
Transducers;
Signal to noise ratio;
Silicon;
Damping;
30.
Topology optimization of a 3D printed acoustic chamber for photoacoustic spectroscopy
机译:
用于光声光谱的3D打印声室的拓扑优化
作者:
Rachid Haouari
;
Veronique Rochus
;
Liesbeth Lagae
;
Xavier Rottenberg
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Laser beams;
Shape;
Mathematical model;
Optimization;
Microphones;
Solids;
Acoustics;
31.
Design optimization for a power package by simulation
机译:
通过仿真对电源封装进行设计优化
作者:
Haibo Fan
;
WW Chow
;
Pompeo V Umali
;
Fei Wong
;
Kai Zhang
;
Haibin Chen
;
Jingshen Wu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Surges;
Junctions;
Reliability;
Inspection;
Heating systems;
Temperature distribution;
32.
Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
机译:
3D集成硅微结构中机械材料性能与应力之间的相关性
作者:
M. Stiebing
;
D. Vogel
;
W. Steller
;
M. J. Wolf
;
U. Zschenderlein
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Silicon;
Through-silicon vias;
Strain;
Copper;
Cooling;
Finite element analysis;
33.
Thermal design of monocular vision system used in automotive application
机译:
汽车应用中单眼视觉系统的热设计
作者:
Gamal Refai-Ahmed
;
Hoa Do
;
Arun Raghupathy
;
Rubab Kadam
;
Jay Gillis
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Cameras;
Temperature measurement;
Atmospheric modeling;
Steady-state;
Temperature sensors;
Solar heating;
Field programmable gate arrays;
34.
Effects of phosphor dispersion on optical characteristics of LED Chip Scale Package LEDs
机译:
磷光体分散度对LED芯片级封装LED光学特性的影响
作者:
Cheng Qian
;
Liang Liang Luo
;
Jia Jie Fan
;
Xiao Qiang Li
;
Xue Jun Fan
;
Guo Qi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Phosphors;
Light emitting diodes;
Dispersion;
Color;
Chip scale packaging;
Optical variables measurement;
Fans;
35.
FEM Simulation of cracks in MLCC during reflow soldering
机译:
回流焊过程中MLCC裂纹的有限元模拟
作者:
Joseph Al Ahmar
;
Steffen Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Capacitors;
Stress;
Ceramics;
Soldering;
Temperature distribution;
Temperature measurement;
36.
Analytical and simulation-based risk assessment of imprint depth and brittle fracture in bond pad stacks
机译:
基于分析和模拟的焊盘叠印深度和脆性断裂风险评估
作者:
Georg M. Reuther
;
Ivan Penjovic
;
Angel Ochoa Brezmes
;
Reinhard Pufall
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Metallization;
Analytical models;
Load modeling;
Finite element analysis;
Needles;
Solid modeling;
37.
SnS monolayer as gas sensors: Insights from a first-principles investigation
机译:
SnS单层作为气体传感器:第一性原理研究的见解
作者:
Fafei Hu
;
Chunjian Tan
;
Huaiyu Ye
;
Xianping Chen
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Adsorption;
Charge transfer;
Atomic layer deposition;
Gas detectors;
Photonic band gap;
Density functional theory;
38.
Model evaluation and improvement for commercially available silicon carbide power MOSFETs
机译:
市售碳化硅功率MOSFET的模型评估和改进
作者:
Andrii Stefanskyi
;
Łukasz Starzak
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Mathematical model;
Semiconductor device modeling;
Silicon carbide;
Resistance;
Numerical models;
Analytical models;
Solid modeling;
39.
Transfer function order reducing method for successive network reduction in complex frequency space
机译:
复杂频率空间连续网络降阶的传递函数阶数降阶方法
作者:
Márton Németh
;
Péter Pálovics
;
András Poppe
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Transfer functions;
Admittance;
Integrated circuit modeling;
Mathematical model;
Electronic packaging thermal management;
Monitoring;
Resistance heating;
40.
Thermal simulation of hybrid circuits with variable heat transfer coefficient
机译:
传热系数可变的混合电路的热仿真
作者:
Tomasz Torzewicz
;
Agnieszka Samson
;
Tomasz Raszkowski
;
Artur Sobczak
;
Marcin Janicki
;
Mariusz Zubert
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Heating systems;
Cooling;
Temperature measurement;
Thermistors;
Atmospheric modeling;
Resistance;
Mathematical model;
41.
Understanding and controlling chromaticity shift in LED devices
机译:
了解和控制LED器件中的色度偏移
作者:
J. Lynn Davis
;
Karmann Mills
;
Michael Lamvik
;
Curtis Perkins
;
Georgiy
;
Bobashev
;
Joseph Young
;
Robert Yaga
;
Cortina Johnson
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Phosphors;
Light emitting diodes;
Oxidation;
Green products;
Sociology;
Statistics;
Testing;
42.
Lifetime prediction based on analytical multi-physics simulation for light-emitting diode (LED) systems
机译:
基于分析多物理场仿真的发光二极管(LED)系统寿命预测
作者:
Xi Yang
;
Zili Wang
;
Yi Ren
;
Bo Sun
;
Cheng Qian
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Light emitting diodes;
Junctions;
Lighting;
Degradation;
Photonics;
Linear programming;
Reliability;
43.
Lead free solder joints characterisation using single lap shear tests
机译:
使用单搭接剪切测试来表征无铅焊点
作者:
S. Pin
;
H. Frémont
;
A. Gracia
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Soldering;
Bars;
Strain;
Monitoring;
Bonding;
Metals;
Load modeling;
44.
Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules
机译:
大功率可调色温板载白光LED模块的发光机理分析
作者:
Jiajie Fan
;
Chaoyi Xie
;
Cheng Qian
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Light emitting diodes;
Temperature measurement;
Color;
Phosphors;
Chip scale packaging;
Lighting;
Temperature distribution;
45.
Rapid testing method for interface crack analysis of an adhesive bonded joint using an electrodynamic shaker
机译:
电动振动筛对胶接接头界面裂纹进行分析的快速测试方法
作者:
C. Vernier
;
M. Dressler
;
H.-P. Seebich
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Testing;
Fatigue;
Electrodynamics;
Frequency control;
Acceleration;
Loading;
Frequency measurement;
46.
Leveraging accelerated testing to assess the reliability of two-stage and multi-channel drivers
机译:
利用加速测试来评估两级和多通道驱动器的可靠性
作者:
J. Lynn Davis
;
Curtis Perkins
;
Aaron Smith
;
Terry Clark
;
Karmann Mills
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Light emitting diodes;
MOSFET;
Testing;
Lighting;
Reliability;
Switches;
47.
Nonlinear modeling and characterization of a thermally driven MEMS actuator with a folded spring reference beam
机译:
具有折叠弹簧参考梁的热驱动MEMS致动器的非线性建模和表征
作者:
Shahabeddin Vamegh Estahbanati
;
Maher Bakri-Kassem
;
Rached Dhaouadi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Actuators;
Micromechanical devices;
Land surface temperature;
Thermal conductivity;
Thermal resistance;
48.
Prognostics health management for LED-based applications
机译:
基于LED的应用的预测和健康管理
作者:
W.D. van Driel
;
B. Jacobs
;
D. Schenkelaars
;
M. Klompenhouwer
;
R. Poelma
;
B. El Mansouri
;
L.M. Middelburg
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Lighting;
Reliability;
Monitoring;
Sensors;
Buildings;
Software;
Complexity theory;
49.
Delamination-induced stitch crack of copper wires
机译:
铜线分层引起的缝线裂纹
作者:
M. van Soestbergen
;
A. Mavinkurve
;
S. Shantaram
;
J.J.M. Zaal
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Compounds;
Stress;
Wires;
Delamination;
Copper;
Lead;
Numerical models;
50.
In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
机译:
电子车载模块的现场条件现场监测和互连完整性
作者:
Riet Labie
;
Bart Vandevelde
;
Wesley van Meensel
;
Mike Vogeleer
;
Daniel Werkhoven
;
Bart Allaert
;
Geert Willems
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Acceleration;
Monitoring;
Loading;
Temperature measurement;
Temperature sensors;
Vibrations;
51.
A model of the electric field in a one-dimensional Micro-Mirror Array and electromechanical simulations and optimization in a single cell
机译:
一维微镜阵列中的电场模型以及单个单元中的机电仿真和优化
作者:
Duy Duc Nguyen
;
Nguyen Nhat Binh Trinh
;
Michel Lenczner
;
Frédéric Zamkotsian
;
Scott Cogan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Mirrors;
Mathematical model;
Force;
Electrostatics;
Optimization;
Electrodes;
Electric potential;
52.
Simulation-driven development of a novel SiC embedded power module design concept
机译:
新型SiC嵌入式功率模块设计概念的仿真驱动开发
作者:
Yafan Zhang
;
Klaus Neumaier
;
Olaf Zschieschang
;
Gerald Weis
;
Gerhard Schmid
;
Mietek Bakowski
;
Hans-Peter Nee
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Multichip modules;
Inductance;
Thermal resistance;
Silicon carbide;
Junctions;
Stress;
53.
Electrical and optical properties of NO and H2S adsorption on Arsenic Phosphorus
机译:
NO和H2S在砷磷上的吸附的电学和光学性质
作者:
Yingying Zhang
;
Kai Zheng
;
Xianping Chen
;
Guoqi Zhang
;
Lian liu
;
Chunjian Tan
;
Qun Yang
;
Junke Jiang
;
Huaiyu Ye
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Adsorption;
Substrates;
Phosphorus;
Silicon;
Photonic band gap;
Atomic measurements;
Charge transfer;
54.
Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
机译:
残余应力对航空电子MEMS压力传感器开裂和分层风险的影响
作者:
J. Auersperg
;
E. Auerswald
;
C. Collet
;
Th. Dean
;
D. Vogel
;
Th. Winkler
;
S. Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Silicon;
Residual stresses;
Bonding;
Delamination;
Substrates;
Finite element analysis;
55.
Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly
机译:
可选的铜柱凸块设计可减少倒装芯片组装过程中引起的热机械应力
作者:
Melina Lofrano
;
Vladimir Cherman
;
Mario Gonzalez
;
Eric Beyne
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Polymers;
Mechanical sensors;
Packaging;
Ions;
Current measurement;
56.
A tool for aided multi-scale model derivation and its application to the simulation of a micro mirror array
机译:
辅助多尺度模型推导的工具及其在微镜阵列仿真中的应用
作者:
Walid Belkhir
;
Nicolas Ratier
;
Duy Duc Nguyen
;
Nguyen Nhat Binh Trinh
;
Michel Lenczner
;
Frédéric Zamkotsian
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Mathematical model;
Mirrors;
Computational modeling;
Electrostatics;
Electrodes;
Tools;
Force;
57.
Design of high voltage 140×100 footprint IGBT module
机译:
高压140×100占位面积IGBT模块的设计
作者:
Daohui Li
;
Matthew Packwood
;
Fang Qi
;
Steve Jones
;
Xiaoping Dai
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Solid modeling;
Integrated circuit modeling;
Strain;
Inductance;
Insulated gate bipolar transistors;
Temperature;
Substrates;
58.
First principle design of CdS/germanene heterostructures with tunable electronic and transport properties
机译:
具有可调电子和输运性质的CdS /锗烷异质结构的第一原理设计
作者:
Kai Zheng
;
Huaiyu Ye
;
Guoqi Zhang
;
Yingying Zhang
;
Lian Liu
;
Junke Jiang
;
Qun Yang
;
Chunjian Tan
;
Xianping Chen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Photonic band gap;
Stacking;
Tensile strain;
Atomic layer deposition;
Optical sensors;
Optical device fabrication;
59.
Optimization of Through Crackstop via using finite element modeling
机译:
通过使用有限元建模优化穿透裂纹
作者:
Mohamed A. Rabie
;
Nick Polomoff
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Load modeling;
Copper;
Dielectrics;
Strain;
Loading;
60.
Highly parallel computations of creep deformation in flip-chip interconnections
机译:
倒装芯片互连中蠕变变形的高度并行计算
作者:
Cedrick Bouchard
;
Julien Sylvestre
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Computational modeling;
Creep;
Deformable models;
Strain;
Stress;
Load modeling;
Laminates;
61.
Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
机译:
使用热诱导剪切载荷的原位TMF测量对在等温测试中校准的不同SAC305材料模型进行验证
作者:
M. Kuczynska
;
N. Schafet
;
U. Becker
;
R. Metasch
;
M. Roellig
;
A. Kabakchiev
;
S. Weihe
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Soldering;
Force;
Force measurement;
Hysteresis;
Biological system modeling;
Load modeling;
62.
Modelling of thermal aging of Moulding Compound by using an equivalent layer assumption
机译:
使用等效层假设对模塑化合物的热老化进行建模
作者:
Bingbing Zhang
;
Alexander Lion
;
Michael Johlitz
;
Leo Ernst
;
K.M.B. Jansen
;
Duc-Khoi Vu
;
Laurens Weiss
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Aging;
Temperature;
Electromagnetic compatibility;
Material properties;
Oxidation;
Compounds;
Numerical models;
63.
Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
机译:
基于内部电隔离的包装基于阳极氧化失效的寿命模型
作者:
R. Schaller
;
V. Strutz
;
H. Theuss
;
R. Dudek
;
S. Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Silicon;
Stress;
Acceleration;
Oxidation;
Humidity;
Leakage currents;
Electrodes;
64.
Determination of E, CTE of thin films from curvature measurement
机译:
通过曲率测量确定薄膜的E,CTE
作者:
S. Ananiev
;
M. Schneegans
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Sensitivity;
Temperature measurement;
Substrates;
Hafnium;
Measurement uncertainty;
Films;
Cooling;
65.
Fin-tube and plate heat exchangers — Evaluation of transient performance
机译:
翅片管和板式换热器—瞬态性能评估
作者:
Ilja Belov
;
Andreas Nordh
;
Kent Salomonsson
;
Peter Leisner
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Transient analysis;
Heating systems;
Electron tubes;
Temperature sensors;
Artificial intelligence;
Monitoring;
66.
Effect of excitation conditions on the durability of high standoff electronic components and assemblies under multiaxial vibration excitation
机译:
激励条件对多轴振动激励下高支座电子零件和组件耐久性的影响
作者:
Raman Sridharan
;
Abhijit Dasgupta
会议名称:
《》
|
2017年
关键词:
Vibrations;
Actuators;
Accelerometers;
Structural beams;
Harmonic analysis;
Finite element analysis;
History;
67.
Requirements specification for multi-domain LED compact model development in Delphi4LED
机译:
Delphi4LED中多域LED紧凑模型开发的需求规范
作者:
A. Alexeev
;
R. Bornoff
;
S. Lungten
;
G. Martin
;
G. Onushkin
;
A. Poppe
;
M. Rencz
;
J. Yu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Light emitting diodes;
Image color analysis;
Lighting;
Electronic packaging thermal management;
Temperature measurement;
Thermal resistance;
Reliability;
68.
A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application
机译:
基于激光散斑光度法的非破坏性方法,用于电力电子应用中直接铜粘结陶瓷的应力条件测量
作者:
S. Muench
;
M. Roellig
;
U. Cikalova
;
B. Bendjus
;
L. Chen
;
S. Sudip
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Speckle;
Ceramics;
Stress measurement;
Copper;
Force;
Optical surface waves;
69.
Multi-physics based system simulations for magnetic sensors
机译:
基于多物理场的磁传感器系统仿真
作者:
Helmut Köck
;
Gernot Binder
;
Frank Heinrichs
;
Gregor Wautischer
;
Florian Bruckner
;
Dieter Süss
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Magnetic domains;
Wheels;
Finite element analysis;
Perpendicular magnetic anisotropy;
Magnetostatics;
Atmospheric modeling;
70.
Influence of Under Bump Metalization dimensions on passivation nitride stress
机译:
凸块下金属化尺寸对钝化氮化物应力的影响
作者:
Raj Sekar Sethu
;
Salil Hari Kulkarni
;
How Ung Ha
;
Kok Heng Soon
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Nickel;
Passivation;
Microelectronics;
Response surface methodology;
Thermal stresses;
Wires;
71.
Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks
机译:
模拟研究,用于比较标准和高度耐用的AlCu厚金属轨
作者:
Raj Sekar Sethu
;
Verena Hein
;
Marco Erstling
;
Kirsten Weide-Zaage
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Standards;
Dielectrics;
Metallization;
Thermal stresses;
Passivation;
72.
Characterization of epoxy based highly filled die attach materials in microelectronics
机译:
微电子学中基于环氧树脂的高填充裸片附着材料的表征
作者:
I. Maus
;
C. Liebl
;
M. Fink
;
D.-K. Vu
;
M. Hartung
;
H. Preu
;
K.M.B. Jansen
;
B. Michel
;
B. Wunderle
;
L. Weiss
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Microassembly;
Curing;
Material properties;
Temperature distribution;
Heating systems;
73.
Understanding the transport phenomena leading to tarnishing of the reflecting silver layer causing reduced light output of LEDs
机译:
了解导致反射银层失去光泽的传输现象,导致LED的光输出降低
作者:
A. Herrmann
;
S.J.F. Erich
;
L.G.J. v.d. Ven
;
W.D. van Driel
;
M. van Soestbergen
;
A. Mavinkurve
;
F. De Buyl
;
O.C.G. Adan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Resins;
Silver;
Light emitting diodes;
Temperature measurement;
Phosphors;
Voltage control;
Films;
74.
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
机译:
LED包装中有机硅/磷复合膜和环氧模塑复合物的吸湿和吸湿膨胀的原位表征
作者:
Ibrahim Khalilullah
;
Talukder Reza
;
Liangbiao Chen
;
A. K. M. Monayem H. Mazumder
;
Jiajie Fan
;
Cheng Qian
;
Guoqi Zhang
;
Xuejun Fan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Moisture;
Mathematical model;
Absorption;
Light emitting diodes;
Electromagnetic compatibility;
Temperature measurement;
Instruments;
75.
Modelling and design of Micro-Opto-Mechanical Pressure Sensors in the presence of residual stresses
机译:
存在残余应力的微光机械压力传感器的建模与设计
作者:
V. Rochus
;
R. Jansen
;
R. Haouari
;
B. Figeys
;
V. Mukund
;
F. Verhaegen
;
J. Goyvaerts
;
P. Neutens
;
J. O Callaghan
;
A. Stassen
;
S. Lenci
;
X. Rottenberg
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Optical waveguides;
Optical sensors;
Residual stresses;
Pressure sensors;
Optical interferometry;
Silicon compounds;
76.
Multi-physics models and condition-based monitoring for 3D-Printing of electronic packages
机译:
电子包装的3D打印的多物理场模型和基于状态的监视
作者:
Chris Bailey
;
Stoyan Stoyanov
;
Tim Tilford
;
Georgios Tourloukis
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Solid modeling;
Three-dimensional printing;
Electronics packaging;
Three-dimensional displays;
Consumer electronics;
Computational modeling;
77.
Simulation of delamination initiation and subsequent propagation using cohesive zones
机译:
使用内聚区模拟分层起始和随后的传播
作者:
Maofen Zhang
;
Daoguo Yang
;
Leo Ernst
;
Bingbing Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Finite element analysis;
Stress;
Delamination;
Load modeling;
Loading;
Biological system modeling;
Electromagnetic compatibility;
78.
An AlAs/germanene heterostructure with outstanding tunability of electronic properties
机译:
具有出色电子性能可调性的AlAs /锗烯异质结构
作者:
Chunjian Tan
;
Qun Yang
;
Huaiyu Ye
;
Xianping Chen
;
G. Q. Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Photonic band gap;
Atomic layer deposition;
Electric fields;
Stacking;
Tensile strain;
79.
Vibration investigation in power module busbar design
机译:
电源模块母线设计中的振动调查
作者:
Matt Packwood
;
Daohui Li
;
Xiapoing Dai
;
Steve Jones
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Bars;
Welding;
Vibrations;
Acoustics;
Analytical models;
Load modeling;
80.
Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
机译:
通过仿真和复杂的光学变形分析评估汽车用消费类部件的板级可靠性
作者:
R. Dudek
;
M. Hildebrand
;
S. Rzepka
;
J. Beintner
;
R. Döring
;
L. Scheiter
;
B. Seiler
;
Th. Fries
;
R. W. Ortmann
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Reliability;
Automotive engineering;
Strain;
Optical variables measurement;
Fatigue;
Moisture;
Stress;
81.
Air-coupled PMUT at 100 kHz with PZT active layer and residual stresses: Multiphysics model and experimental validation
机译:
具有PZT有源层和残余应力的100 kHz空气耦合PMUT:多物理场模型和实验验证
作者:
G. Massimino
;
L. DAlessandro
;
F. Procopio
;
R. Ardito
;
M. Ferrera
;
A. Corigliano
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Numerical models;
Acoustics;
Atmospheric modeling;
Fluids;
Residual stresses;
Solid modeling;
Mathematical model;
82.
Nonlocal continuum damage mechanics approach in the Finite Element simulation of lead-free solder joints
机译:
无铅焊点有限元模拟中的非局部连续介质损伤力学方法
作者:
Youssef Maniar
;
Benjamin Metais
;
Marta Kuczynska
;
Alexander Kabakchiev
;
Peter Binkele
;
Siegfried Schmauder
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Numerical models;
Finite element analysis;
Strain;
Soldering;
Stress;
Softening;
Load modeling;
83.
The numerical analysis of heat transfer at nanoscale using full and reduced DPL models
机译:
使用完整和简化的DPL模型对纳米级传热进行数值分析
作者:
Tomasz Raszkowski
;
Agnieszka Samson
;
Mariusz Zubert
;
Marcin Janicki
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Mathematical model;
Computational modeling;
Heating systems;
Temperature distribution;
Analytical models;
Differential equations;
Numerical models;
84.
A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load
机译:
用于拉伸应力下嵌入金属的碳纳米管失效行为的原位TEM研究的测试设备
作者:
Nathanael Jöhrmann
;
Steffen Hartmann
;
Kiran Jacob
;
Jens Bonitz
;
Kathrine E. MacArthur
;
Sascha Hermann
;
Stefan E. Schulz
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Metals;
Actuators;
Transmission electron microscopy;
Tensile stress;
Atomic measurements;
Resistance heating;
85.
A study on the correlation between experiment and simulation board level drop test for SSD
机译:
SSD的实验与模拟板降落测试的相关性研究
作者:
Tae Min Kang
;
Yong Chang Lee
;
Byung Kwon Bae
;
Won Seob Song
;
Jae Sung Lee
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
86.
Interface comparison involved in flexible electronics using molecular modeling
机译:
使用分子建模的柔性电子学中的接口比较
作者:
N.E. Iwamoto
;
Carol Putman
;
Gregory Vernon
;
Rachel Cramm Horn
;
Aaron Bernreuther
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Copper;
Polymers;
Force;
Moisture;
Adhesives;
Energy barrier;
Integrated circuit modeling;
87.
Impact of wire material and fluorine in dielectric on wire Pull Test stress
机译:
导线材料和电介质中的氟对导线拉力测试应力的影响
作者:
Raj Sekar Sethu
;
Christian Schirrmann
;
How Ung Ha
;
Kok Heng Soon
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Stress;
Wires;
Gold;
Dielectrics;
Copper;
Plasmas;
88.
IR imaging of laser structures for thermal control of Photonics Integrated circuits (PICs)
机译:
用于光子集成电路(PIC)热控制的激光结构的红外成像
作者:
Niamh Richardson
;
Jeff Punch
;
Eric Dalton
;
Marian Carroll
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Surface emitting lasers;
Cameras;
Temperature measurement;
Heating systems;
Measurement by laser beam;
Bars;
89.
Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints
机译:
在焊点热循环过程中通过原位力和位移监测来加速寿命测量
作者:
R. Metasch
;
M. Roellig
;
M. Kuczynska
;
N. Schafet
;
U. Becker
;
K. Meier
;
I. Panchenko
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Temperature sensors;
Force sensors;
Temperature dependence;
Force;
90.
The scope of applicability of DPL model to the heat transfer in electron devices
机译:
DPL模型对电子器件传热的适用范围
作者:
Mariusz Zubert
;
Tomasz Raszkowski
;
Agnieszka Samson
;
Marcin Janicki
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Mathematical model;
Silicon;
Transistors;
Heating systems;
Delay effects;
Thermal analysis;
Analytical models;
91.
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
机译:
在电子SMT组件的热负荷和振动负荷共同作用下的疲劳测量设置
作者:
Karsten Meier
;
René Metasch
;
Mike Roellig
;
Karlheinz Bock
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2017年
关键词:
Temperature measurement;
Vibrations;
Temperature sensors;
Vibration measurement;
Capacitive sensors;
Clamps;
Heating systems;
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