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首页> 外文期刊>International Journal of Heat and Mass Transfer >Heat conduction and thermal conductivity of 3D cracked media
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Heat conduction and thermal conductivity of 3D cracked media

机译：3D裂纹介质的导热和导热系数

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摘要

This study deals with the heat conduction within a medium containing cracks that are assumed to be perfect insulators. Multi-region boundary element approach is employed to obtain a boundary singular integral equation governing the steady state thermal transfer within this medium. This equation presents the temperature field within the whole cracked body as a function of temperature and rate of heat flow on the domain's boundary and temperature discontinuity across the cracks. For the particular case of an infinite domain under far-field condition, the temperature field solution is only a function of the cracks temperature's discontinuity. The basic problem of a single crack in an infinite domain is investigated and a closed-form solution is derived for a crack of elliptic plane from this analysis. This solution is the key issue to estimate the effective thermal conductivity of the whole domain by coupling with the classical homogenization schemes. The arbitrary crack form is covered up by using the excluded volume definition. Estimations of effective thermal conductivities stemming from diluted, differential and self-consistent approaches are compared to numerical solution obtained by the finite volume modeling that is available in literature. This comparison shows that the self-consistent scheme is the most appropriate model to estimate the thermal conductivity of materials containing cracks.
机译：这项研究处理了包含裂纹的介质中的热传导，这些裂纹被认为是理想的绝缘体。采用多区域边界元方法获得控制该介质内稳态热传递的边界奇异积分方程。该方程式将整个裂纹体内的温度场表示为温度和区域边界上的热流速率以及裂纹两端温度不连续性的函数。对于远场条件下无限域的特殊情况，温度场解仅是裂纹温度不连续性的函数。研究了无限域中单个裂纹的基本问题，并由此分析得出了椭圆形平面裂纹的闭合形式解。该解决方案是通过与经典均化方案相结合来估计整个域的有效导热系数的关键问题。使用排除的体积定义掩盖了任意裂纹形式。将稀释，微分和自洽方法产生的有效热导率估算值与通过有限体积模型获得的数值解进行比较，该模型可从文献中获得。这种比较表明，自洽方案是估计包含裂纹的材料的热导率的最合适模型。

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  • 来源
    《International Journal of Heat and Mass Transfer》 |2015年第10期|1119-1126|共8页
  • 作者

    M.N. Vu; S.T. Nguyen; M.H. Vu; A.M. Tang; V.T. To;

  • 作者单位

    R&D Center, Duy Tan University, Da Nang, Viet Nam;

    R&D Center, Duy Tan University, Da Nang, Viet Nam;

    R&D Center, Duy Tan University, Da Nang, Viet Nam,CurisTec, 3 rue Claude Chappe, Parc d'affaire de Crecy, 69370 Saint-Didier-au-Mont-d'Or, France;

    Universite Paris-Est, Laboratoire Navier (ENPC-IFSTTAR-CNRS), 77455 Marne la Vallee, France;

    Le Quy Don Technical University, 100 Hoang Quoc Viet, Hanoi, Viet Nam;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Thermal conductivity; Crack; Insulator; MR-BEM; Self-consistent;

    机译：导热系数;裂纹;绝缘子;MR-BEM;自洽;

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