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Experimental study on heat transfer performance of lotus-type porous copper heat sink

机译：莲花型多孔铜散热器的传热性能实验研究

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摘要

A special kind of micro-channel heat sink was made by using lotus-type porous (also named Gasar) metals with long cylindrical pores formed during unidirectional solidification of metal-gas eutectic system. Copper was selected as the matrix metal because of its high heat conductivity. The heat transfer performance of lotus-type porous copper heat sink with a length of 20 mm along the axial direction of pores was studied on a testing platform designed and set up in this paper. The experimental results show that the lotus-type porous copper heat sink cooled by water has excellent heat transfer performance and a heat transfer coefficient of 5 W/(cm~2 K) is attainable when the porosity is 29% and mean pore diameter is 400 urn An even larger heat transfer coefficient of 9 W/(cm~2 K) can be reached after simply cutting the porous copper along the vertical direction of pore axis into four or eight equal sections alined in the direction of pore axis, because that reducing the length of porous copper heat sink along the direction of pore axis will increase the penetrative porosity, result in increase of flow rate, and then enhance the heat transfer performance of the heat sink. Thus some methods have to be taken to increase the pore length and penetrative porosity when fabricating lotus-type porous copper heat sink.
机译：一种特殊的微通道散热器是通过在金属-气体共晶系统的单向凝固过程中形成的具有长圆柱孔的莲花型多孔（也称为Gasar）金属制成的。铜因其高导热性而被选作基体金属。在设计和建立的试验平台上，研究了沿孔轴向20mm长的莲花型多孔铜散热器的传热性能。实验结果表明，水冷的莲花型多孔铜散热器具有良好的传热性能，当孔隙率为29％，平均孔径为400时，传热系数为5 W /（cm〜2 K）。只需沿孔轴垂直方向将多孔铜切成沿孔轴方向排列的四个或八个相等的部分，就可以达到更大的传热系数9 W /（cm〜2 K）。多孔铜散热片沿孔轴方向的长度会增加渗透孔隙率，导致流量增加，进而提高散热片的传热性能。因此，当制造莲花型多孔铜散热器时，必须采取一些方法来增加孔的长度和穿透性。

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  • 作者

    Huawei Zhang; Liutao Chen; Yuan Liu; Yanxiang Li;

  • 作者单位

    Key Laboratory for Advanced Materials Processing Technology, Ministry of Education, PR China,Department of Mechanical Engineering, Tsinghua University, Beijing 100084, PR China;

    Department of Mechanical Engineering, Tsinghua University, Beijing 100084, PR China;

    Key Laboratory for Advanced Materials Processing Technology, Ministry of Education, PR China,Department of Mechanical Engineering, Tsinghua University, Beijing 100084, PR China;

    Key Laboratory for Advanced Materials Processing Technology, Ministry of Education, PR China,Department of Mechanical Engineering, Tsinghua University, Beijing 100084, PR China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    heat sink; micro channel; chip cooling; heat transfer; porous metal; metal-gas eutectic;

    机译：散热器;微通道芯片冷却;传播热量;多孔金属金属气体共晶;

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