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Controlling heat transfer in micro electron beam welding using volumetric heating

机译:使用体积加热控制微电子束焊接中的传热

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摘要

The small spot sizes and short residence times involved in microwelding demands the use of extremely high power density heat sources, which is beyond the feasible range in welding. The present work explores the use of volumetric heating as a key to employ such high heat intensities for microwelding. Electron beam is represented as a volumetric heat source and a numerical model is developed using commercial finite element softwares to predict the temperature distribution in the solid as a result of beam scanning. The effect of weld speed and beam interaction volume are evaluated to propose the optimum conditions of microwelding. Optimality is based on limited heat flow into the material, high controllability, and tolerable maximum temperature of the process. For the choice of AISI 304 material as an example, the optimum welding conditions required to produce a 2.5 μm weld depth are determined in the non-dimensional form of Peclet number 100 and relative beam penetration in the range of 0.8-1.2.
机译:微焊接中的小点尺寸和短停留时间要求使用极高的功率密度热源,这超出了焊接的可行范围。目前的工作探索了使用体积加热作为将如此高的热强度用于微焊接的关键。电子束被表示为体积热源,并且使用商业有限元软件开发了数值模型,以预测由于束扫描而导致的固体中的温度分布。评估了焊接速度和束相互作用量的影响,以提出微焊接的最佳条件。最佳性是基于有限的热量流入材料,高可控制性以及可承受的过程最高温度。以选择AISI 304材料为例,产生2.5μm焊接深度所需的最佳焊接条件以Peclet号100的无量纲形式确定,相对射束穿透度在0.8-1.2范围内。

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