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首页> 外文期刊>International Journal of Heat and Mass Transfer >Thermal gap conductance at low contact pressures (<1 MPa): Effect of gold plating and plating thickness
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Thermal gap conductance at low contact pressures (<1 MPa): Effect of gold plating and plating thickness

机译：低接触压力（<1 MPa）下的热隙电导：镀金和镀层厚度的影响

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摘要

Thermal contact conductance (TCC) measurements are made on bare and gold plated (≤0.5 μm) oxygen free high conductivity (OFHC) Cu and brass contacts in vacuum, nitrogen, and argon environments. It is observed that the TCC in gaseous environment is significantly higher than that in vacuum due to the enhanced thermal gap conductance. It is found that for a given contact load and gas pressure, the thermal gap conductance for bare OFHC Cu contacts is higher than that for gold plated contacts. It is due to the difference in the molecular weights of copper and gold, which influences the exchange of kinetic energy between the gas molecules and contact surfaces. Furthermore, the gap conductance is found to increase with increasing thickness of gold plating. Topography measurements and scanning electron microscopy (SEM) analysis of contact surfaces revealed that surfaces become smoother with increasing gold plating thickness, thus resulting in smaller gaps and consequently higher gap conductance.
机译：热接触电导（TCC）测量是在真空，氮气和氩气环境下，对裸露和镀金（≤0.5μm）的无氧高导电性（OFHC）铜和黄铜触点进行的。可以看出，由于提高了热隙传导性，气态环境中的TCC明显高于真空环境中的TCC。发现对于给定的接触负载和气体压力，裸OFHC Cu接触的热隙传导率比镀金接触的要高。这是由于铜和金的分子量不同，影响了气体分子与接触表面之间的动能交换。此外，发现间隙电导随着镀金厚度的增加而增加。接触表面的形貌测量和扫描电子显微镜（SEM）分析表明，随着镀金厚度的增加，表面变得更光滑，从而导致更小的间隙，从而产生更高的间隙电导。

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