首页> 外文期刊>International Journal of Heat and Mass Transfer >Inverse determination of surface temperature in thin-film/substrate systems with interface thermal resistance
【24h】

Inverse determination of surface temperature in thin-film/substrate systems with interface thermal resistance

机译:具有界面热阻的薄膜/基板系统中表面温度的反演

获取原文
获取原文并翻译 | 示例
           

摘要

This work examines the effect of interface thermal resistance on the estimation of surface temperatures in thin-film/ substrate systems. A radiation-boundary-condition model based on the acoustic mismatch model (AMM) is employed to consider the interface thermal resistance between thin-film and substrate. The inverse heat conduction problem is solved using the space-marching technique. The influences of interface thermal resistance, measurement locations, and measurement errors on this method are studied in detail. Numerical results show that the inverse method accurately estimates surface conditions and temperature distributions in a two-layer system even with an abrupt temperature drop at the interface. Sensor locations and interface thermal resistance only slightly affect the accuracy of the inverse estimation during the transient process when the exact input data (without measurement errors) are applied. However, the inaccuracy might be amplified by the interface thermal resistance and sensor locations if measurement errors exist.
机译:这项工作研究了界面热阻对薄膜/基板系统表面温度估计的影响。基于声失配模型(AMM)的辐射边界条件模型被用来考虑薄膜和衬底之间的界面热阻。使用空间行进技术可以解决导热逆问题。详细研究了界面热阻,测量位置和测量误差对该方法的影响。数值结果表明,即使界面温度急剧下降,逆方法也能准确估计两层系统中的表面条件和温度分布。当应用精确的输入数据(无测量误差)时,传感器的位置和界面的热阻只会在瞬态过程中对反估计的精度产生轻微影响。但是,如果存在测量误差,则界面热阻和传感器位置可能会加剧这种不准确性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号