首页> 外文期刊>International Journal of Heat and Mass Transfer >HEAT TRANSFER FROM A HORIZONTAL WAFER-BASED DISK OF MULTI-CHIP MODULES
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HEAT TRANSFER FROM A HORIZONTAL WAFER-BASED DISK OF MULTI-CHIP MODULES

机译:基于水平晶片的多芯片模块的传热

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摘要

Convective heat transfer characteristics above a horizontal wafer-based disk heated with 15 simulated chips in unobstructed ambient air have been experimentally investigated under both stationary and rotating disk conditions. Relevant parameters influencing heat transfer performance studied are the Grashof number and rotational Reynolds number. Their effects on heat transfer characteristics in such configurations of stationary and rotational heated disks are successively explored. The heat transfer enhancement of rotation on the heated disk has been investigated; the effect of natural convection on the heat transfer behavior of the heated rotating disk has also been explored.
机译:在固定盘和旋转盘条件下,均已通过实验研究了在15个模拟芯片在无障碍环境空气中加热的水平圆片基盘上方的对流传热特性。影响传热性能的相关参数是格拉索夫数和旋转雷诺数。在固定式和旋转式加热盘的这种构造中,它们对传热特性的影响将被不断探索。已经研究了加热盘旋转的热传递增强;还研究了自然对流对加热的旋转盘的传热行为的影响。

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