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Partially debonded circular inclusion in one-dimensional quasicrystal material with piezoelectric effect

机译:用压电效应部分剥离圆形含有一维的拟壳材料

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摘要

In this first effort, a partially-debonded circular inclusion in a one-dimensional quasicrystal material with piezoelectric effect is studied. This mixed boundary value problem of a circular interface crack is reduced to solving three Riemann-Hilbert problems with the use of analytical continuation theory. The crack-tip singularity of the circular interface crack is investigated and the intensity factors of the stresses in the phonon and the phason fields and electric displacements are derived explicitly. Some particular cases are provided to show the effect of the crack angle, material properties and loadings on the field singularities at the tips of the circular interface crack.
机译:在这首先努力中,研究了具有压电效应的一维拟类材料中的部分剥离圆形包含。圆形界面裂纹的这种混合边值问题减少到求解三个黎曼 - 希尔伯特问题,利用分析延续理论。研究了圆形界面裂纹的裂纹尖端奇异性,并明确地推导了声子和偶像田和电位移中应力的强度因子。提供了一些特定的情况以显示圆形界面裂纹尖端处的抗裂角,材料性质和负载的效果。

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