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首页> 外文期刊>JSME International Journal. Series B, Fluids and Thermal Engineering >Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering
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Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering

机译：红外回流焊过程中电子元件热响应的参数研究

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摘要

A numerical study is performed to predict the thermal response of a card assembly during infrared reflow soldering to attach electronic components to a printed circuit board. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to analyze the sensitivity of the thermal response of electronic components to various conditions such as conveyor speed, exhaust velocities and emissivities. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions such as infrared panel heater temperatures, conveyor speed, and exhaust velocity for each card assembly to ensure proper soldering and minimization of thermally induced card assembly stresses.
机译：进行了一项数值研究，以预测卡组件在红外回流焊接过程中的热响应，以将电子组件连接到印刷电路板上。模拟了回流炉内以及卡组件内的对流，辐射和传导热传递。还进行了参数研究，以分析电子元件对各种条件（例如传送带速度，排气速度和发射率）的热响应的敏感性。详细的卡组件热响应的预测可用于选择烤箱操作条件，例如每个卡组件的红外面板加热器温度，输送机速度和排气速度，以确保正确焊接并最小化热感应卡组件的应力。

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